SOI-based integrated circuits for high-temperature power electronics applications

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn , Issue , 2011, Pages 836-843

  Greenwell, R L ^a   McCue, B M ^a   Zuo, L ^a   Huque, M A ^a   Tolbert, L M ^a   Blalock, B J ^a   Islam, S K ^a  

^a University of Tennessee   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS APPLICATIONS; EXTREME TEMPERATURES; FET SWITCHES; GATE DRIVERS; GROWING DEMAND; HIGH TEMPERATURE; HIGH-TEMPERATURE ELECTRONICS; HIGH-TEMPERATURE POWER; HIGH-VOLTAGES; HYBRID ELECTRIC VEHICLE; LIQUID COOLING; POWER ELECTRONICS MODULES; POWER FETS; POWER-TO-WEIGHT RATIOS; TRACTION DRIVE;

AUTOMOBILE ELECTRONIC EQUIPMENT; AUTOMOBILES; DC-DC CONVERTERS; DRIVES; ELECTRIC VEHICLES; ELECTRONIC COOLING; MESFET DEVICES; POWER ELECTRONICS; SILICON CARBIDE; TRACTION (FRICTION);

DC POWER TRANSMISSION;

EID: 79955781089     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APEC.2011.5744692     Document Type: Conference Paper

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