Novel aluminium-silicon alloys for electronics packaging

Engineering Science and Education Journal

Volumn 6, Issue 5, 1997, Pages 195-201

  Sangha, S P S ^a   Jacobson, D M ^a   Ogilvy, A J W ^a   Azema, M ^a   Junai, A Arun ^a   Botter, E ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; ELECTRONICS PACKAGING; MACHINABILITY; MICROSTRUCTURE; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

ALUMINUM SILICON ALLOYS; ISOTROPIC MICROSTRUCTURE; OSPREY METHOD;

ALUMINUM ALLOYS;

EID: 0031249972     PISSN: 09637346     EISSN: None     Source Type: Journal    
DOI: 10.1049/esej:19970502     Document Type: Article

References (15)