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Volumn 52, Issue 8-9, 2011, Pages 2937-2944

Experimental analysis and FEM simulation of finned U-shape multi heat pipe for desktop PC cooling

Author keywords

Desktop PC CPU; Effective thermal conductivity; Finned heat pipe; Forced convection; Heat transfer coefficient; Thermal resistance

Indexed keywords

AIR VELOCITIES; COOLANT VELOCITY; DESKTOP PC-CPU; EFFECTIVE THERMAL CONDUCTIVITY; EXPERIMENTAL ANALYSIS; EXPERIMENTAL OBSERVATION; FEM SIMULATIONS; FINNED HEAT PIPE; HEAT INPUT; HEAT SOURCES; MULTI-HEAT; PERFORMANCE ANALYSIS; PIPE ORIENTATION; POWER INPUT; RECTANGULAR TUNNEL; SIMULATION RESULT; STEADY-STATE CONDITION; THERMAL RESISTANCE; TRANSIENT TEMPERATURE DISTRIBUTIONS;

EID: 79955663258     PISSN: 01968904     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.enconman.2011.03.001     Document Type: Article
Times cited : (63)

References (18)
  • 1
    • 15044344539 scopus 로고    scopus 로고
    • Next generation devices for electronic cooling with heat rejection to air
    • DOI 10.1115/1.1800512
    • R.L. Webb Next generation devices for electronic cooling with heat rejection to air ASME J Heat Transfer 127 2005 2 10 (Pubitemid 40383002)
    • (2005) Journal of Heat Transfer , vol.127 , Issue.1 , pp. 2-10
    • Webb, R.L.1
  • 4
    • 4544325147 scopus 로고    scopus 로고
    • Heat pipe in modern heat exchangers
    • L.L. Vasiliev Heat pipe in modern heat exchangers Appl Thermal Eng 25 2005 1 19
    • (2005) Appl Thermal Eng , vol.25 , pp. 1-19
    • Vasiliev, L.L.1
  • 6
    • 58649117361 scopus 로고    scopus 로고
    • Heat pipe efficiency enhancement with refrigerant-nanoparticles mixtures
    • P. Naphon, D. Thongkum, and P. Assadamongkol Heat pipe efficiency enhancement with refrigerant-nanoparticles mixtures Energy Convers Manage 50 2009 772 776
    • (2009) Energy Convers Manage , vol.50 , pp. 772-776
    • Naphon, P.1    Thongkum, D.2    Assadamongkol, P.3
  • 7
    • 62649092466 scopus 로고    scopus 로고
    • Investigation into performance of a heat pipe with micro grooves fabricated by extrusion-ploughing process
    • W. Xiaowu, T. Yong, and C. Ping Investigation into performance of a heat pipe with micro grooves fabricated by extrusion-ploughing process Energy Convers Manage 50 2009 1384 1388
    • (2009) Energy Convers Manage , vol.50 , pp. 1384-1388
    • Xiaowu, W.1    Yong, T.2    Ping, C.3
  • 8
    • 77955320083 scopus 로고    scopus 로고
    • Experimental investigation into the performance of heat pipe with microgrooves fabricated by Extrusion-ploughing process
    • T. Yong, C. Ping, and W. Xiaowu Experimental investigation into the performance of heat pipe with microgrooves fabricated by Extrusion-ploughing process Energy Convers Manage 51 2010 1849 1854
    • (2010) Energy Convers Manage , vol.51 , pp. 1849-1854
    • Yong, T.1    Ping, C.2    Xiaowu, W.3
  • 9
    • 79961204250 scopus 로고    scopus 로고
    • Application of aqueous nanofluids in a horizontal mesh heat pipe
    • in press http://dx.doi.org/10.1016/j.enconman.2010.07.001
    • Liu ZH, Zhu QZ. Application of aqueous nanofluids in a horizontal mesh heat pipe. Energy Convers Manage, in press. http://dx.doi.org/10.1016/j. enconman.2010.07.001.
    • Energy Convers Manage
    • Zh, L.1    Zhu, Q.Z.2
  • 10
    • 0031239918 scopus 로고    scopus 로고
    • Enhancing forced air convection heat transfer from an array of parallel plate fins using a heat pipe
    • Z. Zhao, and C.T. Avedisianz Enhancing forced air convection heat transfer from an array of parallel plate fins using a heat pipe Int J Heat Mass Transfer 40 13 1997 3135 3147
    • (1997) Int J Heat Mass Transfer , vol.40 , Issue.13 , pp. 3135-3147
    • Zhao, Z.1    Avedisianz, C.T.2
  • 11
    • 0035691782 scopus 로고    scopus 로고
    • Steady state analysis of cooling electronic circuits using heat pipes
    • DOI 10.1109/6144.974941, PII S1521333101089231
    • J. Legierski, B. Wiecek, and G. de Mey Steady state analysis of cooling electronic circuits using heat pipes IEEE Trans Compon Pack Technol 24 4 2001 549 553 (Pubitemid 34091922)
    • (2001) IEEE Transactions on Components and Packaging Technologies , vol.24 , Issue.4 , pp. 549-553
    • Legierski, J.1    Wiecek, B.2
  • 13
    • 79955453352 scopus 로고    scopus 로고
    • A novel approach for cooling electronics using a combined heat pipe and thermoelectric module
    • B. Saengchandr, and N.V. Afzulpurkar A novel approach for cooling electronics using a combined heat pipe and thermoelectric module Am J Eng Appl Sci 2 4 2009 603 610
    • (2009) Am J Eng Appl Sci , vol.2 , Issue.4 , pp. 603-610
    • Saengchandr, B.1    Afzulpurkar, N.V.2
  • 14
    • 77953915639 scopus 로고    scopus 로고
    • Experimental investigation on the thermal performance and optimization of heat sink with U-shape heat pipes
    • T.S. Liang, and Y.M. Hung Experimental investigation on the thermal performance and optimization of heat sink with U-shape heat pipes Energy Convers Manage 51 2010 2109 2116
    • (2010) Energy Convers Manage , vol.51 , pp. 2109-2116
    • Liang, T.S.1    Hung, Y.M.2
  • 15
    • 34547842885 scopus 로고    scopus 로고
    • Experimental investigations of thermal resistance of a heat sink with horizontal embedded heat pipes
    • J.C. Wang, H.S. Huang, and S.L. Chen Experimental investigations of thermal resistance of a heat sink with horizontal embedded heat pipes Int Commun Heat Mass Transfer 34 2007 958 970
    • (2007) Int Commun Heat Mass Transfer , vol.34 , pp. 958-970
    • Wang, J.C.1    Huang, H.S.2    Chen, S.L.3
  • 16
    • 77952903944 scopus 로고    scopus 로고
    • Novel thermal resistance network analysis of heat sink with embedded heat pipes
    • J.-C. Wang Novel thermal resistance network analysis of heat sink with embedded heat pipes Jordan J Mech Ind Eng 2 1 2008 23 30
    • (2008) Jordan J Mech Ind Eng , vol.2 , Issue.1 , pp. 23-30
    • Wang, J.-C.1
  • 17
    • 0011882188 scopus 로고    scopus 로고
    • 2nd ed. McGraw New York
    • YunusA Cengel Heat transfer 2nd ed. 2003 McGraw New York p. 466 and 468
    • (2003) Heat Transfer
    • Cengel, Y.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.