Low-temperature glass bonding for development of silicon carbide/zirconium tungsten oxide porous ceramics with near zero thermal expansion coefficient

Journal of the American Ceramic Society

Volumn 94, Issue 5, 2011, Pages 1354-1356

  Poowancum, Anurat ^a   Matsumaru, Koji ^a   Ishizaki, Kozo ^a  

^a NAGAOKA UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADVANCED MANUFACTURING; ALKALINE EARTH OXIDES; BONDING AGENT; DECOMPOSITION TEMPERATURE; LOW TEMPERATURES; LOW-TEMPERATURE GLASS; LOW-TEMPERATURE SINTERING; NEGATIVE THERMAL EXPANSION MATERIAL; POROUS CERAMICS; THERMAL EXPANSION COEFFICIENTS; THERMAL EXPANSIVITY; TUNGSTEN OXIDE; ZERO THERMAL EXPANSION;

ALKALINE EARTH METALS; BOROSILICATE GLASS; CERAMIC MATERIALS; ELECTRONICS ENGINEERING; GLASS BONDING; MANUFACTURE; POROUS SILICON; SILICON CARBIDE; SILICON OXIDES; SINTERING; TUNGSTEN; TUNGSTEN COMPOUNDS; ZIRCONIUM;

THERMAL EXPANSION;

EID: 79955521916     PISSN: 00027820     EISSN: 15512916     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2011.04520.x     Document Type: Article

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