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Volumn 10, Issue 9, 2010, Pages 6190-6194
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A simple cost-effective sputtering-based method for micropatterning and materials microstructuring
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Author keywords
Cobalt; Copper; Micropatterning; Microstructuring; Platinum; Porous Silicon; Silicon; Sputtering; Thin Films
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Indexed keywords
COST-EFFECTIVE METHODS;
ETCHING PROCESS;
GRID SIZE;
HIGH ENERGY;
HIGH VACUUM;
LASER-ASSISTED;
MAGNETIC FORCE;
MAGNETIC SIGNALS;
MAGNETO-OPTIC KERR EFFECT;
METALLIC GRID;
MICROCOLUMNS;
MICROPATTERNING;
MICROSTRUCTURING;
MODERN TECHNOLOGIES;
PATTERNED MATERIALS;
PT FILMS;
RADIO FREQUENCIES;
SILICON NETWORKS;
SPUTTERING CONDITIONS;
SPUTTERING POWER;
ATOMIC FORCE MICROSCOPY;
COBALT;
COPPER;
COST EFFECTIVENESS;
HIGH ENERGY PHYSICS;
KERR MAGNETOOPTICAL EFFECT;
MAGNETISM;
MAGNETOMETERS;
MAGNETRONS;
MICROSTRUCTURE;
PLATINUM;
SEMICONDUCTING SILICON COMPOUNDS;
SILICON WAFERS;
THIN FILMS;
POROUS SILICON;
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EID: 79955427414
PISSN: 15334880
EISSN: None
Source Type: Journal
DOI: 10.1166/jnn.2010.2592 Document Type: Conference Paper |
Times cited : (1)
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References (13)
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