Synthesis and characterization of low temperature Sn nanoparticles for the fabrication of highly conductive ink

Nanotechnology

Volumn 22, Issue 22, 2011, Pages

  Jo, Yun Hwan ^a   Jung, Inyu ^a   Choi, Chung Seok ^a   Kim, Inyoung ^b   Lee, Hyuck Mo ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Korea Institute of Machine and Materials   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE INK; CONDUCTIVE PATTERNS; ELECTRICAL PROPERTY; GRAM SCALE; HYDROGEN REDUCTION; ISOPROPYL ALCOHOLS; LOW COSTS; LOW TEMPERATURES; MIXED SOLVENT; MODIFIED POLYOL PROCESS; PLASMA ASHING; SI WAFER; SIZE-DEPENDENT MELTING;

ELECTRIC PROPERTIES; ELECTRIC RESISTANCE; ETHYLENE; ETHYLENE GLYCOL; INK; INK JET PRINTERS; INK JET PRINTING; NANOPARTICLES; ORGANIC SOLVENTS; POLYMER BLENDS; REACTION KINETICS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SINTERING; SURFACE TENSION;

TIN;

EID: 79954491477     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/22/22/225701     Document Type: Article

References (51)

1. Huang D, Liao F, Molesa S, Redinger D and Subramanian V 2003 J. Electrochem. Soc. 150 G412
2. Sirringhaus H, Kawase T, Friend R H, Shimoda T, Inbasekaran M, Wu W and Woo E P 2000 Science 290 2123
3. Perelaer J, Klokkenburg M, Hendriks C E and Schubert U S 2009 Adv. Mater. 21 4830
4. Fisslthaler E, Sax S, Scherf U, Mauthner G, Moderegger E, Landfester K and List E J W 2008 Appl. Phys. Lett. 92 183305
5. Eom S H, Senthilarasu S, Uthirakumar P, Yoon S C, Lim J, Lee C, Lim H S, Lee J and Lee S-H 2009 Org. Electron. 10 536
6. Hoth C N, Schilinsky P, Choulis S A and Brabec C J 2010 Macromol. Symp. 291/292 287
7. Cao Q, Kim H-S, Pimparkar N, Kulkarni J P, Wang C, Shim M, Roy K, Alam M A A and Rogers J A nature 454 495
8. Kim J D, Choi J S, Kim B S, Choi Y C and Cho Y W 2010 Polymer 51 2147
9. Calvert P 2001 Chem. Mater. 13 3299
10. Park B K, Kim D, Jeong S, Moon J and Kim J S 2007 Thin Solid Films 515 7706
11. Hoth C N, Choulis S A, Schilinsky P and Brabec C J 2007 Adv. Mater. 19 3973
12. Denneulin A, Bras J, Blayo A, Khelifi B, Roussel-Dherbey F and Neuman C 2009 Nanotechnology 20 385701
13. Small W R, Masdarolomoor F, Wallace G G and Panhuis M I H 2007 J. Mater. Chem. 17 4359
14. Cuk T, Troian S M, Hong C M and Wagner S 2000 Appl. Phys. Lett. 77 2063
15. Ko S H, Pan H, Grigoropoulos C P, Luscombe C K, Frechet J M J and Poulikakos D 2007 Nanotechnology 18 345202
16. Fuller S B, Wilhelm E J and Jacobson J M 2002 J. Microelectromech. Syst. 11 54
17. Bieri N R, Chung J, Haferl S E, Poulikakos D and Grigoropoulos C P 2003 Appl. Phys. Lett. 82 3529
18. Chung J W, Ko S W, Bieri N R, Grigoropoulos C P and Poulikakos D 2004 Appl. Phys. Lett. 84 801
19. Bieri N R, Chung J, Poulikakos D and Grigoropoulos C P 2004 Superlattice. Microstruct. 35 437
20. Lee H H, Chou K S and Huang K C 2005 Nanotechnology 16 2436
21. Zou C-D, Gao Y-L, Yang B and Zhai Q-J 2010 Trans. Nonfer. Met. Soc. China 20 248
22. Lai S L, Guo J Y, Petrova V, Ramanath G and Allen L H 1996 Phys. Rev. Lett. 77 99
23. Chou N H and Schaak R E 2007 J. Am. Chem. Soc. 129 7339
24. Grandjean D, Benfield R E, Nayral C, Maisonnat A and Chaudret B 2004 J. Phys. Chem. B 108 8876
25. Nayral C, Viala E, Fau P, Senocq F, Jumas J C, Maisonnat A and Chaudret B 2000 Chem. Eur. J. 6 4082
26. Leonard B M and Schaak R E 2006 J. Am. Chem. Soc. 128 11475
27. Park B K, Jeong S, Kim D, Moon J, Lim S and Kim J S 2007 J. Colloid Interface Sci. 311 417
28. Niederberger M, Bartl M H and Stucky G D 2002 Chem. Mater. 14 4364
29. Ung T 2004 Scr. Mater. 51 777
30. Wang Y, Lee J Y and Deivaraj T C 2004 J. Mater. Chem. 14 362
31. Nayral C, Ould-Ely T, Maisonnat A, Chaudret B, Fau P, Lescouzeres L and Peyre-Lavigne A 1999 Adv. Mater. 11 61
32. Park J C and Song H 2007 Chem. Mater. 19 2706
33. Duphil D, Bastide S and Levy-Clement C 2002 J. Mater. Chem. 12 2430
34. Jiang H J, Moon K S, Dong H, Hua F and Wong C P 2006 Chem. Phys. Lett. 429 492
35. Buffat P and Borel J P 1976 Phys. Rev. A 13 2287
36. Coombes C J 1972 J. Phys. F: Met. Phys. 2 441
37. Allen G L, Bayles R A, Gile W W and Jesser W A 1986 Thin Solid Films 144 297
38. Eckert J, Holzer J C, Ahn C C, Fu Z and Johnson W L 1993 Nanostruct. Mater. 2 407
39. Sun S H, Meng G W, Zhang M G, An X H, Wu G S and Zhang L D 2004 J. Phys. D: Appl. Phys. 37 409
40. Nair P K, Nair M T S, Zingaro R A and Meyers E A 1994 Thin Solid Films 239 85
41. Suryanarayanan V, Nair A S, Tom R T and Pradeep T 2004 J. Mater. Chem. 14 2661
42. Dick K, Dhanasekaran T, Zhang Z Y and Meisel D 2002 J. Am. Chem. Soc. 124 2312
43. Kofman R, Cheyssac P, Aouaj A, Lereah Y, Deutscher G, Bendavid T, Penisson J M and Bourret A 1994 Surf. Sci. 303 231
44. Yamazoe N, Fuchigami J, Kishikawa M and Seiyama T 1979 Surf. Sci. 86 335
45. Szuber J, Czempik G, Larciprete R, Koziej D and Adamowicz B 2001 Thin Solid Films 391 198
46. Song S-K, Cho J-S, Choi W-K, Jung H-J, Choi D, Lee J-Y, Baik H-K and Koh S-K 1998 Sensors Actuators B 46 42
47. Wang Y, Ma J, Ji F, Yu X and Ma H 2005 J. Lumin. 114 71
48. An G, Na N, Zhang X, Miao Z, Miao S, Ding K and Liu Z 2007 Nanotechnology 18 435707
49. Brandes E A and Brook G B 1983 Smithells Metals Reference Book 7th edn pp19-2
50. Szczech J B, Megaridis C M, Gamota D R and Zhang J 2002 IEEE Trans. Electron. Packag. 25 26
51. Szczech J B, Megaridis C M, Zhang J and Gamota D R 2004 Microsc. Therm. 8 327