Wafer-level chip scale flexible wireless microsystem fabrication

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2011, Pages 344-347

  Chao, Tzu Yuan ^a   Cheng, Y T ^a  

^a Institute of Electronics   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING STRENGTH; CHIP SCALE; CMOS CHIPS; INTERCONNECTING STRUCTURES; LOW COST FABRICATION; ORGANIC SUBSTRATE; RELEASE PROCESS; RETURN LOSS; WAFER LEVEL; WIRELESS MICROSYSTEM;

FABRICATION; MECHANICAL ENGINEERING; MECHANICS; MICROSYSTEMS; REACTIVE ION ETCHING; SURFACE CLEANING; WAFER BONDING;

MEMS;

EID: 79953784070     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2011.5734432     Document Type: Conference Paper

References (9)

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