SCOPUS 정보 검색 플랫폼

2010 6th International Conference on Integrated Power Electronics Systems, CIPS 2010

Volumn , Issue , 2011, Pages

Pure Low Temperature Joining Technique power module for automotive production needs

(3) Schulze, Elisabeth a Mertens, Christian a Lindemann, Andreas b

a VOLKSWAGEN AG (Germany)

b OTTO VON GUERICKE UNIVERSITY (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVE POWER ELECTRONICS; AUTOMOTIVE PRODUCTION; COMPACT DESIGNS; ELECTRIC POWER; HIGH COSTS; HIGH RELIABILITY; JOINING TECHNIQUES; KEY TECHNOLOGIES; LONG LIFE; LOW TEMPERATURES; POWER MODULE; PROCESSING STEPS; SEMICONDUCTOR CHIPS;

AUTOMOBILE PARTS AND EQUIPMENT; JOINING; LOW TEMPERATURE PRODUCTION; POWER ELECTRONICS;

AUTOMOBILE ELECTRONIC EQUIPMENT;

EID: 79953764410 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (18)

References (9)

1
- 0025800802
- Novel large area joining technique for improved power device performance
- DOI 10.1109/28.67536
- Schwarzbauer, H.; Kuhnert, R.: Novel Large Area Joining Technique for Improved Power Device Performance. IEEE Trans. Ind. Appl. 27, 1991, Nr. 1, S. 93-95. (Pubitemid 21663317)
- (1991) IEEE Transactions on Industry Applications , vol.27 , Issue.1 PART 1 , pp. 93-95
- Schwarzbauer Herbert¹ Kuhnert Reinhold²

2
- 84991238523
- The road to the next generation power module - 100% solder free design
- Nurnberg
- Scheuermann, U.; Beckedahl, P.: The Road to the Next Generation Power Module - 100% Solder Free Design. Proc. of CIPS08, Nurnberg, 2008.
- (2008) Proc. of CIPS08
- Scheuermann, U.¹ Beckedahl, P.²

3
- 78651281424
- VDI Verlag, Dusseldorf, PhD Thesis
- Rudzki, J.: Aufbaukonzepte fur die Leistungselektronik mit der Niedertemperaturverbindungstechnik. PhD thesis, VDI Verlag, Dusseldorf, 2006.
- (2006) Aufbaukonzepte fur die Leistungselektronik mit der Niedertemperaturverbindungstechnik
- Rudzki, J.¹

4
- 79953754180
- Top-Side contacts with low temperature joining technique (LTJT)
- Aachen
- Mertens, C.; Rudzki, J.; Sittig, R.: Top-Side Contacts with Low Temperature Joining Technique (LTJT). Proc. CIPS04, Aachen, 2004.
- (2004) Proc. CIPS04
- Mertens, C.¹ Rudzki, J.² Sittig, R.³

5
- 79953760957
- Reliable chip contact joining
- Nurnberg
- Eisele, R.; Rudzki, J.; Migdalek, D.; Rabsch, T.: Reliable Chip Contact Joining. PCIM Europe Conference, Nurnberg, 2009.
- (2009) PCIM Europe Conference
- Eisele, R.¹ Rudzki, J.² Migdalek, D.³ Rabsch, T.⁴

6
- 34748841580
- Double-sided low-temperature joining technique for power cycling capability at high temperature
- Dresden
- Amro, R.; Lutz, J.; Rudzki, J.; Thoben, M.; Lindemann, A.: Double-Sided Low-Temperature Joining Technique for Power Cycling Capability at High Temperature. Proc. of EPE05, Dresden, 2005.
- (2005) Proc. of EPE05
- Amro, R.¹ Lutz, J.² Rudzki, J.³ Thoben, M.⁴ Lindemann, A.⁵

7
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- Pressure sintering for thermal stack assembly
- Nurnberg
- Eisele, R.; Rudzki, J.; Kock, M.: Pressure Sintering for Thermal Stack Assembly. Proc. of PCIM07, Nurnberg, 2007.
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- Eisele, R.¹ Rudzki, J.² Kock, M.³

8
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- Low temperature joining technique for improved reliability
- Bremen
- Mertens, C.;Sittig, R.: Low Temperature Joining Technique for Improved Reliability. Proc. of CIPS02, Bremen, 2002.
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- Mertens, C.¹ Sittig, R.²

9
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- PhD thesis, VDI Verlag, Dusseldorf
- Mertens, C.: Die Niedertemperatur-Verbindungstechnik der Leistungselektronik. PhD thesis, VDI Verlag, Dusseldorf, 2004.
- (2004) Die Niedertemperatur-Verbindungstechnik Der Leistungselektronik
- Mertens, C.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.