Role of interface on dynamic modulus of high-performance poly(etheretherketone)/ceramic composites

Journal of Applied Polymer Science

Volumn 121, Issue 1, 2011, Pages 436-444

  Goyal, R K ^a   Tiwari, A N ^b   Negi, Y S ^c  

^a Department of Instrumentation & Control Engineering   (India)

^b INDIAN INSTITUTE OF TECHNOLOGY BOMBAY   (India)

^c INDIAN INSTITUTE OF TECHNOLOGY ROORKEE   (India)

Author keywords

dynamic mechanical properties; electronic packaging; interface; polymer matrix composites; scanning electron microscope

Indexed keywords

AGGREGATE FORMATION; ALN; CERAMIC COMPOSITES; DYNAMIC MECHANICAL PROPERTY; DYNAMIC MODULI; ELECTRONIC PACKAGING; EXPERIMENTAL DATA; FILLED COMPOSITES; HALPIN-TSAI MODEL; HIGH FREQUENCY; HIGHER TEMPERATURES; INTERFACE; MATRIX; MATRIX COMPOSITE; MICRON SIZE; ON DYNAMICS; POOR ADHESION; ROOM TEMPERATURE; SCANNING ELECTRON MICROSCOPE; SCANNING ELECTRON MICROSCOPES; SEM; TEMPERATURE RANGE; THEORETICAL MODELS; UNIFORM DISTRIBUTION;

ADHESION; AGGLOMERATION; ALUMINUM; ALUMINUM NITRIDE; DYNAMICS; ELECTRON MICROSCOPES; ELECTRONICS PACKAGING; MATRIX ALGEBRA; MECHANICAL PROPERTIES; NITRIDES; PRINTED CIRCUIT BOARDS; SCANNING; SCANNING ELECTRON MICROSCOPY;

POLYMER MATRIX COMPOSITES;

EID: 79953690485     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.33684     Document Type: Article

References (43)

1. Frederic, N. C., Thermoplastic Aromatic Polymer Composites; Butterworth Heinemann Ltd.: Oxford, 1992.
2. Goyal, R. K.,;, Tiwari, A. N.,;, Mulik, U. P.,;, Negi, Y. S., Compos Sci Technol 2007, 67, 1802.
3. Quella, F.,;, Bogner, M.,;, Holzapfel, W.,;, Schwarz, R., IEEE Trans Compon Hybrids Manuf Technol 1991, 14, 8779.
4. Yao, X. F.,;, Yeh, H. Y.,;, Zhou, D.,;, Zhang, Y. H., J Comp Mater 2006, 40, 371.
5. Hegde, S.,;, Pucha, R. V.,;, Sitaraman, S. K., J Mater Sci: Mater Sci 2004, 15, 287.
6. Wong, C. P.,;, Raja, S. B., J Appl Polym Sci 1999, 74, 3396.
7. Teh, P. L.,;, Jaafar, M.,;, Akil, H. M.,;, Seetharamu, K. N.,;, Wagiman, A. N. R.,;, Beh, K. S., Polym Adv Technol 2008, 19, 308.
8. Jenness, J. R., Jr.,;, Kline, D. E., J Appl Polym Sci 1973, 17, 3391.
9. Sandler, J.,;, Werner, P.,;, Sheffer, M. S. P.,;, Demchuk, V.,;, Altstädt, V.,;, Windle, A. H., Compos A 2002, 33, 1033.
10. Selzer, R.,;, Friedrich, K., Compos A 1997, 28, 595.
11. Goyal, R. K.,;, Tiwari, A. N.,;, Mulik, U. P.,;, Negi, Y. S., Compos A 2007, 38, 516.
12. Goyal, R. K.,;, Tiwari, A. N.,;, Mulik, U. P.,;, Negi, Y. S., J Appl Polym Sci 2007, 104, 568.
13. Zhang, Z.,;, Klein, P.,;, Friedrich, K., Comps Sci Technol 2002, 62, 1001.
14. Kim, J.-W.,;, Cho, W.-W.,;, Ha, C.-S., J Polym Sci Part B: Polym Phys 2002, 40, 19.
15. Vollenberg, P. H. T.,;, Heikens, D., Polymer 1989, 30, 1656.
16. Vollenberg, P. H. T.,;, Heikens, D., Polymer 1989, 30, 1663.
17. Tsagaropoulos, G.,;, Eisenberg, A., Macromolecules 1995, 28, 6067.
18. Nakmura, Y.,;, Yamaguchi, M.,;, Okubo, M.,;, Matsumoto, T., J Appl Polym Sci 1992, 44, 151.
19. Melo, J. D. D.,;, Radford, D. W., Compos A 2002, 33, 1505.
20. Krishnaswami, R. K.,;, Kalika, D. S., Polymer 1994, 3560, 1157.
21. Adam, R. D.,;, Gaitonde, J. M., Compos Sci Technol 1993, 47, 271.
22. Tregub, A.,;, Harel, H. M., Comps Sci Technol 1993, 48, 185.
23. Jonas, A.,;, Legras, R., Macromolecules 1993, 26, 813.
24. Goyal, R. K.,;, Tiwari, A. N.,;, Negi, Y. S., Eur Polym J 2034 2005, 41.
25. Farebrother, T. H.,;, Raymond, J. A., In Polymer Engineering Composites;, Richardson, M. O. W., Ed.; Applied Science: London, 1977; pp 197-235.
26. Kubat, J.,;, Rigdahl, M.,;, Welander, M., J Appl Polym Sci 1990, 39, 1527.
27. Bikiaris, D. N.,;, Papageorgiou, G. Z.,;, Pavlidou, E.,;, Vouroutzis, N.,;, Palatzoglou, P.,;, Karayannidis, G. P., J Appl Polym Sci 2006, 100, 2684.
28. Hanchi, J.,;, Eiss, N. S., Jr., Wear 1997, 203-204, 380.
29. Ishida, H.,;, Rimdusit, S., Thermochem Acta 1998, 320, 177.
30. Electronic Materials Handbook, Packaging, Vol. 1, ASM International Handbook, 1989.
31. Tummala, R. R.,;, Rymaszewski, E. J.,;, Klopfenstein, A. G., Eds. Microelectronics Packaging Handbook, Subsystem Packaging, Part 3, 2nd ed; Chapman & Hall: Netherlands.
32. Xu, Y.,;, Chung, D. D. L.,;, Mroz, C., Compos A 2001, 32, 1749.
33. Suzhu, Y.,;, Peter, H., J Appl Polym Sci 2000, 78, 1348.
34. Ling, W.,;, Gu, A.,;, Liang, G.,;, Yuan, L.,;, Liu, J., Polym Adv Technol 2009, 21, 365.
35. Jin, Z.,;, Pramoda, K. P.,;, Xu, G.,;, Goh, S. H., Chem Phys Lett 2001, 337, 43.
36. Choi, Y.-K.,;, Sugimoto, K.-I.,;, Song, S.-M.,;, Gotoh, Y.,;, Ohkoshi, Y.,;, Endo, M., Carbon 2005, 43, 2199.
37. Gu, W.,;, Wu, H. F.,;, Kampe, S. L.,;, Lu, G.-Q., Mater Sci Eng A 2000, 277, 237.
38. Paipetis, S. A., Fiber Sci Technol 1980, 13, 449.
39. Ahmed, S.,;, Jones, F. R., J Mater Sci 1990, 25, 4933.
40. Elias, H.-G., (Ed.). An Introduction to Plastics, 2nd ed; Wiley-VCH: Weinhein, 2003.
41. Lewis, T. B.,;, Nielsen, L.E., J Appl Polym Sci 1970, 14, 1449.
42. Tavaman, I. H., Powder Technol 1997, 91, 63.
43. Hussain, M.,;, Nakahira, A.,;, Nishijima, S.,;, Niihara, K., Mater Lett 1996, 26, 299.