High performance SOC for mobile applications

2010 IEEE Asian Solid-State Circuits Conference, A-SSCC 2010

Volumn , Issue , 2010, Pages 133-136

  Woo, Nam Sung ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ARCHITECTURE DESIGNS; COMPUTING PERFORMANCE; ENGINEERING EXPERTISE; LOW-POWER COMPUTING; LOW-POWER CONSUMPTION; MOBILE APPLICATIONS; OPTIMAL SOLUTIONS; SILICON PROCESSING; SMART PHONES; TECHNICAL FACTORS; WIDE SPECTRUM;

MOBILE DEVICES;

MOBILE TELECOMMUNICATION SYSTEMS;

EID: 79952854691     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASSCC.2010.5716548     Document Type: Conference Paper

References (2)

1. Lau, J. H., and Tang, G., "Thermal Management of 3D IC Integration with TSV (Through Silicon Via)", IEEE Proceedings of Electronic, Components & Technology Conference, pp. 635-640, 2009.
2. Kernel development statistics for 2.6.35. [Online], Available: http://lwn.net/Articles/395961/