Electrical resistance as a nondestructive evaluation technique for SiC/SiC ceramic matrix composites under creep-rupture loading

International Journal of Applied Ceramic Technology

Volumn 8, Issue 2, 2011, Pages 298-307

  Smith, Craig E ^a   Morscher, Gregory N ^b   Xia, Zhenhai ^b  

^a NASA GLENN RESEARCH CENTER   (United States)

^b University of Akron   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONVENTIONAL TECHNIQUES; CRACK DEPTHS; CREEP-RUPTURE; ELECTRICAL RESISTANCES; HIGH TEMPERATURE; IN-SITU; LINEAR RELATIONSHIPS; MATRIX CRACK; MATRIX PORE; NON-DESTRUCTIVE EVALUATION TECHNIQUES; SIC/SIC COMPOSITES;

CERAMIC MATERIALS; CRACKS; CREEP; ELECTRIC RESISTANCE; STRESS ANALYSIS; STRESS CONCENTRATION;

CERAMIC MATRIX COMPOSITES;

EID: 79952578063     PISSN: 1546542X     EISSN: 17447402     Source Type: Journal    
DOI: 10.1111/j.1744-7402.2010.02587.x     Document Type: Article

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