Embedded non-destructive evaluation for structural health monitoring, damage detection, and failure prevention

Shock and Vibration Digest

Volumn 37, Issue 2, 2005, Pages 83-105

  Giurgiutiu, Victor ^a   Cuc, Adrian ^a  

^a University of South Carolina   (United States)

Author keywords

Adhesive joints; Adhesives; Crack propagation; Damage detection; Electromechanical impedance; Lamb waves; Migration technique; Phased array; Piezoelectric wafer active sensors; Pitch catch, pulse echo; Structural health monitoring; Time reversal; Ultrasonic

Indexed keywords

CRACK PROPAGATION; ELECTRIC IMPEDANCE; FAILURE ANALYSIS; FREQUENCIES; PIEZOELECTRICITY; SENSORS; STRUCTURAL ANALYSIS; ULTRASONIC TESTING;

DAMAGE DETECTION; ELECTROMECHANICAL IMPEDANCE; LAMB WAVES; MIGRATION TECHNIQUE; PHASED ARRAYS; PIEZEOELECTRIC WAFER ACTIVE SENSORS; PITCH-CATCH; PULSE ECHO; STRUCTURAL HEALTH MONITORING; TIME REVERSAL;

NONDESTRUCTIVE EXAMINATION;

EID: 17644415319     PISSN: 05831024     EISSN: None     Source Type: Journal    
DOI: 10.1177/0583102405052561     Document Type: Article

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