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Materials Letters

Volumn 65, Issue 8, 2011, Pages 1201-1203

Solution growth of Cu2S nanowalls on Cu substrates and their characterization

(3) Nien, Yung Tang a Chang, Yu Hsuan a Chen, In Gann a

a NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

Author keywords

Copper sulfide; Hydrophobicity; Nanostructures; Schottky contact; Solution growth

Indexed keywords

COPPER SULFIDES; CU SUBSTRATE; ELECTRICAL CURRENT; ETCHING REACTION; MONOCLINIC PHASE; NANOWALLS; ROUGH SURFACES; SCANNING ELECTRON MICROSCOPIC; SCHOTTKY BARRIERS; SCHOTTKY CONTACTS; SIMPLE METHOD; SOLUTION GROWTH; TEM; WATER CONTACT ANGLE MEASUREMENT; X-RAY ENERGY DISPERSIVE SPECTROMETRY;

ANGLE MEASUREMENT; CHARACTERIZATION; CONTACT ANGLE; HYDROPHOBICITY; NANOSTRUCTURES; SCHOTTKY BARRIER DIODES; SODIUM; THICKNESS MEASUREMENT; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

SUBSTRATES;

EID: 79952451341 PISSN: 0167577X EISSN: None Source Type: Journal
DOI: 10.1016/j.matlet.2011.01.051 Document Type: Article

Times cited : (6)

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