Micro channel fabrication in LTCC substrate

Proceedings - 2005 IMAPS/ACerS 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2005

Volumn , Issue , 2005, Pages 29-31

  Kinzy Jones, W ^a   Kappagantula, Surya ^a   Wang, Jaing ^a  

^a Florida International University   (United States)

Author keywords

LTCC; Micro cavity; Micro channels; Z axis channels

Indexed keywords

ELECTRONIC PACKAGING; LTCC; MATERIALS AND PROCESS; MICROCHANNEL FABRICATION; POWER DENSITIES; VERTICAL CHANNELS; WAFER-SCALE PACKAGING; Z-AXIS CHANNELS;

CERAMIC MATERIALS; EXHIBITIONS; FABRICATION; MICROSYSTEMS; ORGANIC LASERS; SUBSTRATES; TEMPERATURE CONTROL; THICK FILMS;

CHIP SCALE PACKAGES;

EID: 79952185699     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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2. Ibid. pp. 109.
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