LTCC based MEMS impingement coolers

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5231, Issue , 2003, Pages 211-216

  Saxena, K ^a   Wang, G ^a   Ang, S ^a   Elshabini, A ^a   Barlow, F ^a  

^a UNIVERSITY OF ARKANSAS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; ELECTRONICS PACKAGING; FIRING (OF MATERIALS); LOW TEMPERATURE EFFECTS; MICROELECTROMECHANICAL DEVICES; SILICON WAFERS; THERMOMECHANICAL TREATMENT; THICKNESS MEASUREMENT;

HYBRID TECHNOLOGY; LOW TEMPERATURE COFIRED CERAMICS; MICROJET ARRAYS;

POWER ELECTRONICS;

EID: 0042329660     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. J.E. Leland, R. Ponnapan, and K.S. Klasing "Experimental investigation of an air micro-jet array impingement cooling device" American institute of Aeronautics and Astronautics. AIAA-99-0476, 1999.
2. Kercher, DM, Tabakoff, W. "Heat Transfer by a Square array of Round Jets Impinging Perpendicular to a flat surface including the Effect of the Spent air", Journal of Engineering for Power, Transactions of ASME, Ser. A, Vol. 92, Jan 1970, pp. 73-92.
3. Kaneez E-Shahrer Banu "Micromachined heat sink for integrated circuit cooling" University Of Arkansas, Fayetteville, August 1999.
4. Qin-Yi Tong, Giho Cha, Roman Gafiyeanu and Ulrich Gosele. "Low temperature Wafer Direct Bonding". Journal of Micro electromechanical systems, Vol.3 No.1, March 1994.
5. A.A. Ayon, X. Zhang, K. Turner, D. Choi, B. Miller, S. Nagle and S.M. Spearing. "Low Temperature Silicon Wafer Bonding For MEMS Applications", Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS), 2002, p411-414.
6. 2 Layer of Silicon Wafer Direct Bonding" International Conference on Solid-State and Integrated Circuit Technology Proceedings, 1998, p765-767.
7. Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging Cheng, Y.T. (Univ of Michigan at Ann Arbor); Lin, Liwei; Najafi, Khalil Journal of Microelectromechanical Systems, v 9.