A new approach to joining of bulk copper using microwave energy

Materials and Design

Volumn 32, Issue 5, 2011, Pages 2685-2694

  Srinath, M S ^a   Sharma, Apurbba Kumar ^a   Kumar, Pradeep ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY ROORKEE   (India)

Author keywords

C. Joining; F. Microstructure; G. X ray analysis

Indexed keywords

BULK SURFACES; C. JOINING; CHARACTERISATION; DOMINANT ORIENTATION; ELEMENTAL ANALYSIS; EXPOSURE-TIME; F. MICROSTRUCTURE; HIGH THERMAL CONDUCTIVITY; JOINT AREA; METALLIC MATERIAL; METALLURGICAL BONDING; METALLURGICAL BONDS; MICROWAVE ENERGIES; MICROWAVE EXPOSURE; MULTIMODE APPLICATOR; NEW APPROACHES; NOVEL METHODS; PHASE ANALYSIS; PLATE FORMS; POROSITY MEASUREMENT; POWDER PARTICLES; PREFERENTIAL ORIENTATION; SUSCEPTOR MATERIAL; ULTIMATE TENSILE STRENGTH; UNIFORM MICROSTRUCTURE; XRD ANALYSIS;

CHARCOAL; COPPER; COPPER POWDER; COPPER POWDER METALLURGY; HEATING; JOINING; METALLURGY; MICROSTRUCTURE; MICROWAVE HEATING; MICROWAVES; TENSILE STRENGTH; TENSILE TESTING; X RAY ANALYSIS; X RAY DIFFRACTION; X RAYS;

COPPER OXIDES;

EID: 79952184753     PISSN: 02641275     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matdes.2011.01.023     Document Type: Article

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