Fracture behaviour of a self-healing microcapsule-loaded epoxy system

Express Polymer Letters

Volumn 5, Issue 3, 2011, Pages 246-253

  Lee, J ^a   Bhattacharyya, D ^a   Zhang, M Q ^b   Yuan, Y C ^b  

^a UNIVERSITY OF AUCKLAND   (New Zealand)

^b SUN YAT SEN UNIVERSITY   (China)

Author keywords

Fracture and fatigue; Microcapsules; Polymer composites; Self healing; Smart polymers

Indexed keywords

EID: 79551639732     PISSN: 1788618X     EISSN: None     Source Type: Journal    
DOI: 10.3144/expresspolymlett.2011.24     Document Type: Article

References (18)

1. Murphy E. B., Wudl F.: The world of smart healable materials. Progress in Polymer Science, 35, 223-251 (2010). DOI: 10.1016/j.progpolymsci.2009.10.006
2. Yuan Y. C., Yin T., Rong M. Z., Zhang M. Q.: Self healing in polymers and polymer composites. Concepts, realization and outlook: A review. Express Polymer Letters, 2, 238-250 (2008). DOI: 10.3144/expresspolymlett.2008.29
3. White S. R., Sottos N. R., Geubelle P. H., Moore J. S., Kessler M. R., Sriram S. R., Brown E. N., Viswanathan S.: Autonomic healing of polymer composites. Nature, 409, 794-797 (2001). DOI: 10.1038/35057232
4. Kessler M. R., Sottos N. R., White S. R.: Self-healing structural composite materials. Composites Part A: Applied Science and Manufacturing, 34, 743-753 (2003). DOI: 10.1016/S1359-835X(03)00138-6
5. Brown E., Sottos N., White S.: Fracture testing of a self-healing polymer composite. Experimental Mechanics, 42, 372-379 (2002). DOI: 10.1007/BF02412141
6. Cho S. H., Andersson H. M., White S. R., Sottos N. R., Braun P. V.: Polydimethylsiloxane-based self-healing materials. Advanced Materials, 18, 997-1000 (2006). DOI: 10.1002/adma.200501814
7. Caruso M. M., Blaiszik B. J., White S. R., Sottos N. R., Moore J. S.: Full recovery of fracture toughness using a nontoxic solvent-based self-healing system. Advanced Functional Materials, 18, 1898-1904 (2008). DOI: 10.1002/adfm.200800300
8. Jinglei Y., Keller M. W., Moore J. S., White S. R., Sottos N. R.: Microencapsulation of isocyanates for selfhealing polymers. Macromolecules, 41, 9650-9655 (2008). DOI: 10.1021/ma801718v
9. Brown E., White S., Sottos N.: Fatigue crack propagation in microcapsule-toughened epoxy. Journal of Materials Science, 41, 6266-6273 (2006). DOI: 10.1007/s10853-006-0512-y
10. Karger-Kocsis J., Friedrich K.: Microstructure-related fracture toughness and fatigue crack growth behaviour in toughened, anhydride-cured epoxy resins. Composites Science and Technology, 48, 263-272 (1993). DOI: 10.1016/0266-3538(93)90143-5
11. Nagasawa M., Kinuhata H., Koizuka H., Miyamoto K., Tanaka T., Kishimoto H., Koike T.: Mechanical fatigue of epoxy resin. Journal of Materials Science, 30, 1266-1272 (1995). DOI: 10.1007/BF00356129
12. Kamphaus J. M., Rule J. D., Moore J. S., Sottos N. R., White S. R.: A new self-healing epoxy with tungsten (VI) chloride catalyst. Journal of the Royal Society: Interface, 5, 95-103 (2008). DOI: 10.1098/rsif.2007.1071
13. Li Y., Liang G-Z., Xie J-Q., He S-B.: Synthesis and characterization of microencapsulated dicyclopentadiene with melamine-formaldehyde resins. Colloid and Polymer Science, 285, 781-791 (2007). DOI: 10.1007/s00396-006-1621-5
14. Yuan Y. C., Rong M. Z., Zhang M. Q., Chen J., Yang G. C., Li X. M.: Self-healing polymeric materials using epoxy/mercaptan as the healant. Macromolecules, 41, 5197-5202 (2008). DOI: 10.1021/ma800028d
15. Yuan L., Liang G., Xie J., Li L., Guo J.: Preparation and characterization of poly(urea-formaldehyde) microcapsules filled with epoxy resins. Polymer, 47, 5338-5349 (2006). DOI: 10.1016/j.polymer.2006.05.051
16. Dobetti L., Pantaleo V.: Application of a hydrodynamic model to microencapsulation by coacervation. Journal of Microencapsulation, 19, 139-151 (2002). DOI: 10.1080/02652040110055199
17. Brown E. N., White S. R., Sottos N. R.: Microcapsule induced toughening in a self-healing polymer composite. Journal of Materials Science, 39, 1703-1710 (2004). DOI: 10.1023/B:JMSC.0000016173.73733.dc
18. Yin T., Rong M. Z., Zhang M. Q., Yang G. C.: Selfhealing epoxy composites - Preparation and effect of the healant consisting of microencapsulated epoxy and latent curing agent. Composites Science and Technology, 67, 201-212 (2007). DOI: 10.1016/j.compscitech.2006.07.028