Nonlinear buckling analysis of vertical wafer probe technology

Microsystem Technologies

Volumn 16, Issue 11, 2010, Pages 1909-1920

  Hauck, Torsten ^a   Müller, Wolfgang H ^b   Schmadlak, Ilko ^a  

^a Freescale Halbleiter Deutschland GmbH   (Germany)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE STRUCTURES; BACK-END-OF-LINE INTERCONNECT; BOND PAD; BUCKLING BEAMS; CLOSED FORM; DESIGN RESTRICTION; DIE SIZE; ELASTIC STABILITY; FINITE ELEMENT SIMULATIONS; LARGE DEFLECTION; MECHANICAL ROBUSTNESS; NONLINEAR BUCKLING ANALYSIS; NUMERICAL SIMULATION; PAD STRUCTURES; PROBE CARDS; WAFER PROBES;

ELECTRIC VARIABLES MEASUREMENT; PLATES (STRUCTURAL COMPONENTS);

PROBES;

EID: 79551507557     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-010-1115-8     Document Type: Article

References (5)

1. Chen W-F, Atsuta T (2008) Theory of beam-columns. In: Plane behavior and design, vol 1. J. Ross Publishing, Fort Lauderdale
2. Gummert P, Reckling K-A (1987) Mechanik, 2. Auflage, Vieweg Verlag
3. Hibbeler RC (2005) Mechanics of materials, 6th edn. Reed Educational and Professional Publishing, New Jersey
4. Mann WR, Taber FL, Seitzer PW, Broz JJ (2004) The leading edge of production wafer probe test technology. International test conference 2004 (ITC'04), pp 1168-1195
5. Timoshenko SP, Gere JM (1961) Theory of elastic stability, 2nd edn. McGraw-Hill, New York