Study of copper precipitation behavior in a Cu-bearing austenitic antibacterial stainless steel

Materials and Design

Volumn 32, Issue 4, 2011, Pages 2374-2379

  Ren, Ling ^a,b   Nan, Li ^a   Yang, Ke ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

[No Author keywords available]

Indexed keywords

AGING TIME; AUSTENITIC; COPPER PRECIPITATION; ELECTRICAL RESISTIVITY; ELECTRICAL RESISTIVITY MEASUREMENTS; ELECTROCHEMICAL IMPEDANCE; PRECIPITATION BEHAVIOR; TEM;

AUSTENITE; BEARINGS (STRUCTURAL); CORROSION RESISTANT ALLOYS; ELECTRIC CONDUCTIVITY; ELECTROCHEMICAL PROPERTIES; HARDNESS; PRECIPITATION (CHEMICAL); TRANSMISSION ELECTRON MICROSCOPY;

STAINLESS STEEL;

EID: 79251641320     PISSN: 02641275     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matdes.2010.11.030     Document Type: Article

References (29)

1. Zhang Z.X., et al. Effects of light pre-deformation on pitting corrosion resistance of copper-bearing ferrite antibacterial stainless steel. J Mater Proc Technol 2008, 205:419-424.
2. Zhan A.F., Li L.J., Qiao J.Y., AI L. Microstructure and antibacterial properties of antibacterial martensite stainless steel. Foundary Technol 2009, 30:860-863.
3. Chen S.H., Lv M.Q., Zhang J.D., Dong J.S., Yang K. Microstructure antibacterial properties of Cu-contained antibacterial stainless steel. Acta Metall Sinica 2004, 40:314-318.
4. Zhang Z.X., Lin G., Zhou X. Precipitation behavior of antibacterial phase in copper-bearing ferrite antibacterial stainless steel. Trans Mater Heat Treat 2008, 29:93-96.
5. Li H.W., Zhang T.B., Zhang T.Y. Observation and analysis of ε-Cu phase in the antibacterial austenite stainless steel containing Cu. Acta Metall Sinica 2008, 44:39-42.
6. Xiong J., Xu B.F., Ni H.W. Antibacterial and corrosive properties of copper implanted austenitic stainless steel. Int J Miner, Metall Mater 2009, 16:293-298.
7. Viswanathan U.K., Nayar P.K.K., Krishnan R. Kinetics of precipitation in 17-4Ph stainless steel. Mater Sci Technol 1989, 5:346-349.
8. Thompson S.W., Krauss G. Copper precipitation during continuous cooling and isothermal aging of a 710-type steels. Metall Mater Trans 1996, 27:1573-1588.
9. Hornbogen E., Glenn R.C. A metallographic study of precipitation of copper from alpha iron. Trans Metall Soc AIME 1960, 218:1064-1070.
10. Zhang A.F., Qiao J.Y., Li L.J., Zhang X. Microstructure and antibacterial properties of austenite antibacterial stainless steel. J Mater Sci Eng 2006, 26:669-672.
11. Qiu W.J., Lin G., Jiang L.Z., He G. Effect of Cu on properties of antibacterial austenitic stainless steel. Iron Steel 2009, 44:81-84.
12. Hsiao C.N., Chiou C.S., Yong J.R. Aging reactions in a 17-4Ph stainless steel. Mater Chem Phys 2002, 74:132-142.
13. Ratchev P., Verlinden B., et al. Precipitation hardening of an Al-42 wt% Mg-0.6 wt% Cu alloy. Acta Mater 1998, 46:3523-3533.
14. Dieter I., Gagliano M.S., Fine M.E., et al. Interfacial Segregation at Cu-rich precipitates in a high strength low-carbon steel studied on a sub-nanometer scale. Acta Mater 2006, 54:841-849.
15. Kozo O., Hiroshi O., Kazuo A., et al. SANS Study of phase decomposition in Fe-Cu alloy with Ni and Mn addition. ISIJ Int 1994, 34(4):346.
16. Ren H., Mao W. Precipitation behavior of B2-like particle in Fe-Cu binary alloy. J Univ Sci Technol, Beijing 2002, 9:185-187.
17. Wang D.F., Yang H.C., Hou L.D. Research on precipitation sequence of Cu-Ni-Si alioy during aging. Ordnance Mater Sci Eng 2005, 28:25-27.
18. Harry T., Bacon D.J. Computer simulation of the core structure the <111> of screw dislocation in [alpha]-iron containing copper precipitates: II dislocation-precipitate interaction and the strengthening effect. Acta Mater 2002, 50:209-222.
19. Hong S.I., Hill M.A. Mechanical stability and electrical conductivity of Cu-Ag filamentary microcomposites. Mater Sci Eng A 1999, 264:151-158.
20. Heringhaus F., Schneider-Muntau H.J., et al. Analytical modeling of the electrical conductivity of metal matrix composites application to Ag-Cu and Cu-Nb. Mater Sci Eng A 2003, 347:9-20.
21. Ahmat P., Fan Z.G., Luo Q., Xu Y.Z. Microstructure study on home-made modified 316L stainless steel. Atom Energy Sci Technol 2003, 37:18-21.
22. MacDonald J.R., Johnson W.B. Impedance spectroscopy, emphasizing solid materials and systems 1987, Wiley, VCH, New York.
23. Trethewey K.R., Paton M. Electrochemical impedance behavior of type 304L stainless steel under tensile loading. Mater Lett 2004, 58:3381-3384.
24. Starink M.J., Abeels V.M.F., Mourik van P. Lattice parameter and hardness variations resulting from precipitation and misfit accommodation in a particle-reinforced Al-Si-Cu-Mg alloy. Mater Sci Eng A 1993, 163:115-125.
25. Ivan H., Ernst K. Computer simulation of the yield strength evolution in Cu-precipitation strengthened ferritic steel. Mater Sci Eng A 2010, 527:3546-3551.
26. Gaffar M.A., Gaber A., Mostafa M.S., et al. The effect of Cu addition on the thermoelectric power and electrical resistivity of Al-Mg-Si balanced alloy: A correlation study. Mater Sci Eng A 2007, 465:274-282.
27. Rana R., Singh S.B., Mohanty O.N. Thermoelectric power studies of copper precipitation in a new interstitial-free steel. Scripta Mater 2006, 55:1107-1110.
28. Hong I.T., Koo C.H. Antibacterial Properties, corrosion resistance and mechanical properties of Cu-modified SUS 304 stainless steel. Mater Sci Eng A 2005, 393:213-222.
29. Yang Y., Cheng S.C., Yang G. Effect of Cu addition on the creep rupture properties of super 304H steel. Mater Mech Eng 2002, 26:23-25.