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Volumn 465, Issue 1-2, 2007, Pages 274-282
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The effect of Cu addition on the thermoelectric power and electrical resistivity of Al-Mg-Si balanced alloy: A correlation study
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Author keywords
Al Mg Si Cu alloy; Electrical resistivity; Q phase; Thermoelectric power; phase
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Indexed keywords
AGING OF MATERIALS;
COMPOSITION EFFECTS;
COPPER;
ELECTRIC CONDUCTIVITY;
METALLOGRAPHIC MICROSTRUCTURE;
THERMOELECTRIC POWER;
INTERMEDIATE PHASE;
LATTICE RIGIDITY;
ALUMINUM ALLOYS;
AGING OF MATERIALS;
ALUMINUM ALLOYS;
COMPOSITION EFFECTS;
COPPER;
ELECTRIC CONDUCTIVITY;
METALLOGRAPHIC MICROSTRUCTURE;
THERMOELECTRIC POWER;
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EID: 34347220542
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/j.msea.2007.02.023 Document Type: Article |
Times cited : (33)
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References (39)
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