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Volumn 465, Issue 1-2, 2007, Pages 274-282

The effect of Cu addition on the thermoelectric power and electrical resistivity of Al-Mg-Si balanced alloy: A correlation study

Author keywords

Al Mg Si Cu alloy; Electrical resistivity; Q phase; Thermoelectric power; phase

Indexed keywords

AGING OF MATERIALS; COMPOSITION EFFECTS; COPPER; ELECTRIC CONDUCTIVITY; METALLOGRAPHIC MICROSTRUCTURE; THERMOELECTRIC POWER;

EID: 34347220542     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.02.023     Document Type: Article
Times cited : (33)

References (39)
  • 38
    • 85161657608 scopus 로고    scopus 로고
    • M.J. Mageto, TEM study of microstructure in relation to hardness and ductility in Al-Mg-Si (6xxx) alloys, MSc Thesis, Norwegian University of Sci. and Tech., 2003.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.