Diffusion behavior of W in the WCu/Ni interface

International Journal of Refractory Metals and Hard Materials

Volumn 29, Issue 2, 2011, Pages 153-157

  Cui, Jie ^a   Liang, Shuhua ^a   Yue, Wei ^a   Wang, Xianhui ^a  

^a XI'AN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Ab initio calculations; Diffusion; Sintering; Ternary alloy systems

Indexed keywords

AB INITIO CALCULATIONS; DIFFUSION BEHAVIOR; DIFFUSION COUPLE; DIFFUSION LAYERS; EXPERIMENTAL DATA; FIRST PRINCIPLE METHOD; INTERDIFFUSION COEFFICIENTS; SIMULATION RESULT; TERNARY ALLOY SYSTEMS; TRANSITIONAL LAYERS;

ALLOYING; PHASE INTERFACES; SCANNING ELECTRON MICROSCOPY; SINTERING; SOLID SOLUTIONS; SOLIDIFICATION; TERNARY ALLOYS; TERNARY SYSTEMS; TRANSMISSION ELECTRON MICROSCOPY;

DIFFUSION;

EID: 79251598989     PISSN: 02634368     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijrmhm.2010.09.009     Document Type: Article

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