Effect of reductants and their properties of electric resistivity on the preparation of Ag coated Cu powders by chemical reduction method

Journal of Korean Institute of Metals and Materials

Volumn 48, Issue 12, 2010, Pages 1097-1102

  Ahn, Jong Gwan ^a   Yoon, Chi Ho ^b   Kim, Dong Jin ^a   Cho, Sung Wook ^a   Park, Je Shin ^c  

^a Korea Institute of Geosceince and Mineral Resources   (South Korea)

^b Daejoo Co   (South Korea)

^c Chonbuk National University   (South Korea)

Author keywords

Ag coated Ju powder; Chemical reduction; Potassium sodium tartrate; Powder processing; Specific resistivity

Indexed keywords

AG COATED JU POWDER; ATOMIC ABSORPTION SPECTROPHOTOMETER; CHEMICAL REDUCTION; CHEMICAL REDUCTION METHODS; COMPOSITE POWDERS; DEPOSITION PROCESS; ELECTRIC RESISTIVITY; FEEDING RATE; IONIC SOLUTIONS; OPTIMUM CONDITIONS; POWDER PROCESSING; PROBE RESISTIVITY; REDUCTANTS; ROOM TEMPERATURE; SCANNING ELECTRON MICROSCOPES; SILVER LAYER; SPECIFIC RESISTIVITIES; WELL-DISPERSED; X RAY DIFFRACTOMETERS;

COPPER POWDER; COPPER POWDER METALLURGY; ELECTRIC CONDUCTIVITY; ELECTROMAGNETIC SHIELDING; POTASSIUM; POWDERS; RADIATION PROTECTION; SCANNING ELECTRON MICROSCOPY; SODIUM;

SILVER;

EID: 78751522484     PISSN: 17388228     EISSN: None     Source Type: Journal    
DOI: 10.3365/KJMM.2010.48.12.1097     Document Type: Article

References (23)

1. K. S. Yun, Y. C. Park, B. S. Yang, H. H. Min, and C. W. Won, J. Korean Powder Metall. Inst. 12, 56 (2005).
2. S. Y Park, T. W. Yoon, C. H. Lee, I. B. Jeong, and S. H. Hyun, Powder Metall. World Congress 1076 (2006).
3. V. Privman, D. V. Goia, J. S. Park, and E. Matijevic, J. Colloid Interface Sci. 213, 36 (1999).
4. Y. T. Yu and Y Y Choi, Kor. J. Mater. Res. 13, 524 (2003).
5. Y. M. Park, H. H. Jin, S. R. Kim, H. C. Park, and S. Y Yoon, Kor. J. Mater. Res. 14,790 (2004).
6. A. M. Litman, D. M. Staggs, and N. E. Fowler, Technical Papers, Regional Tech. Conf 127 (1982).
7. X. Xu, X. Luo, H. Zhuang, W. Li, and B. Zhang, Mat. Letter. 57, 3987 (2003).
8. D. Russev, D. Raclev, and S. Kava, J. Met. Finish. 81, 27 (1983).
9. Koto, et al, US Patent No. 4, 652, 465 (1987).
10. T. Hayashi, US Patent No. 5, 178, 909 (1993).
11. H.Y Lee and J. K. Oh, J. of Korean Inst, of Resources Recycling. 14, 21 (2005).
12. A. Tsaliovich, Electromagnetic shielding handbook for wired and wireless EMC application, Kluwer Academic Publisher (1999).
13. K. M. Lim, M. C. Kim, K. A. Lee, and C. G Park, J. Kor. Inst. Met. & Mater. 41, 180 (2003).
14. Y Nagasawa, Plastic Korea, 10, 46 (1997).
15. H. G Kim, Electromagnetic waves and the human body, p.139-193, YoungPoong BookStore Co, Ltd, Korea (1996).
16. T. Raghu, R. Sundaresan, P. Ramakrishnan, and T. R. Rama Mohan, Mater. Sci. Eng. (A) 304-306, 438 (2001).
17. K. I. Kim and Y S. Park, TCI Report, BA555, 24 (2006).
18. S. Djokic, M. Dubois, and R. H. Lepard, US Patent No. 5, 945, 158(1999).
19. H. T. Hai, J. G Ahn, D. J. Kim, J. R. Lee, H. S. Chung, and C. O. Kim, Surface & Coating Tech. 201, 3788 (2006).
20. O. Keles, Hydrometallugy 95, 333 (2009).
21. K. H. Kim. H. J. Sohn, and T. Kang, J. Kor. Inst. Met. & Mater. 24, 663 (1986).
22. Yaritsune Torao, Coating Materials for Electronics, Technical report no. 27, p. 13-30, CMC, Tokyo (1982).
23. M. K. Song, S. M. Hong, and J. M. Park, Polym. Sci. Technol 12, 690(2001).