Atomic scale studies of spall behavior in nanocrystalline Cu

Journal of Applied Physics

Volumn 108, Issue 11, 2010, Pages

  Dongare, Avinash M ^a   Rajendran, Arunachalam M ^b   Lamattina, Bruce ^c   Zikry, Mohammed A ^a   Brenner, Donald W ^a  

^a North Carolina State University   (United States)

^b UNIVERSITY OF MISSISSIPPI   (United States)

^c U S ARMY RESEARCH OFFICE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC SCALE; AVERAGE GRAIN SIZE; DUCTILE FAILURES; DYNAMIC LOADINGS; FAST NUCLEATION; IMPACT VELOCITIES; LARGE-SCALE MOLECULAR DYNAMICS; MICROMECHANISMS; NANOCRYSTALLINE CU; NANOCRYSTALLINE METAL; SINGLE CRYSTAL COPPER; SPALL STRENGTH; VOID GROWTH; VOID NUCLEATION;

COALESCENCE; COPPER; DYNAMIC LOADS; GRAIN GROWTH; MICROSTRUCTURE; MOLECULAR DYNAMICS; NUCLEATION; SINGLE CRYSTALS; VELOCITY;

STRAIN RATE;

EID: 78751509794     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3517827     Document Type: Article

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