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Volumn 21, Issue 5, 2011, Pages 1438-1446

The return of photoelastic stress measurements: Utilizing birefringence to monitor damage and repair in healable materials

Author keywords

[No Author keywords available]

Indexed keywords

A-THERMAL; CALIBRATION CURVES; COMPRESSIVE LOADING; DAMAGE EVENTS; DICYCLOPENTADIENE; DIELS-ALDER CYCLOADDITIONS; INDUCED STRESS; NON-CONTACT; NONDESTRUCTIVE METHODS; REAL TIME ANALYSIS; SIMILAR MATERIAL; SPECIMEN DIMENSION; TRANSPARENT POLYMER;

EID: 78751499281     PISSN: 09599428     EISSN: 13645501     Source Type: Journal    
DOI: 10.1039/c0jm02308f     Document Type: Article
Times cited : (14)

References (29)
  • 27
    • 0000023488 scopus 로고    scopus 로고
    • Vishay Micro-Measurements Tech Note TN-702-2, Introduction to Stress Analysis by the PhotoStress® Method
    • T. Takahashi G. Fuller Rheol. Acta 1996 35 297 302
    • (1996) Rheol. Acta , vol.35 , pp. 297-302
    • Takahashi, T.1    Fuller, G.2
  • 29
    • 78751541875 scopus 로고    scopus 로고
    • unpublished results and in ESI
    • E. B. Murphy and F. Wudl, unpublished results and in ESI.
    • Murphy, E.B.1    Wudl, F.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.