Characterization and properties of electroless nickel plated poly (ethylene terephthalate) nonwoven fabric enhanced by dielectric barrier discharge plasma pretreatment

Plasma Science and Technology

Volumn 12, Issue 6, 2010, Pages 715-722

  Geng, Yamin ^a   Lu, Canhui ^a   Liang, Mei ^a   Zhang, Wei ^a  

^a SICHUAN UNIVERSITY   (China)

Author keywords

dielectric barrier discharge plasma; electroless nickel plating; poly(ethylene terephthalate) (PET); surface properties

Indexed keywords

ABSORPTIVE CAPACITY; ACTIVE LAYER; ADHESION STRENGTHS; AGING BEHAVIOR; AIR-PLASMA TREATMENT; DIELECTRIC BARRIER DISCHARGE PLASMAS; ELECTRICAL RESISTIVITY; ELECTROLESS NICKEL; ELECTROLESS NICKEL PLATING; ELECTROMAGNETIC INTERFERENCE; FREQUENCY RANGES; NON-WOVEN; PALLADIUM CATALYST; PLASMA TREATMENT; PRE-TREATMENT; PRETREATMENT METHODS; SEM; SHIELDING EFFECTIVENESS; SURFACE CHEMICAL COMPOSITION; UNIFORM COATING;

ADHESION; ATMOSPHERIC PRESSURE; CATALYSTS; DIELECTRIC DEVICES; ELECTRIC CONDUCTIVITY; ELECTRIC DISCHARGES; ELECTROMAGNETIC PULSE; ELECTROMAGNETIC SHIELDING; ETHYLENE; FLOW CONTROL; FUNCTIONAL GROUPS; FUNCTIONAL MATERIALS; LIQUIDS; MORPHOLOGY; NICKEL; NICKEL COATINGS; NICKEL PLATING; NONWOVEN FABRICS; OXYGEN; PALLADIUM; PLASMA APPLICATIONS; PLASMA THEORY; POLYETHYLENE TEREPHTHALATES; RADIATION PROTECTION; SURFACE PROPERTIES; SURFACE TREATMENT; TIN; WEAVING; X RAY DIFFRACTION;

SURFACE MORPHOLOGY;

EID: 78651470509     PISSN: 10090630     EISSN: None     Source Type: Journal    
DOI: 10.1088/1009-0630/12/6/14     Document Type: Article

References (34)

1. Zhou J D, Jiang W, Zhang X J, et al. 2009, Mater. Lett., 63: 282
2. Merlos A, Esteve J, Acero M C, et al. 1995, Sens. Actuators B, 26∼27: 336
3. Inagaki N, Tasaka S, Narushima K, et al. 1999, Macro-molecules, 32: 8566
4. Bewilogua K, Cooper C V, Specht C, et al. 2000, Surf. Coat. Technol., 127: 224
5. Ehrich H, Hasse B, Mausbach M, et al. 1990, Vac. Sci. Technol. A, 8: 2160
6. Fang X, Ma T, Akiyama M, et al. 2005, Thin Solid Films, 472: 242
7. Syed Azim S, Satheesh A, Ramu K K, et al. 2006, Prog. Org. Coat., 55: 1
8. Zhang Q Y, Wu M, Zhao W. 2005, Surf. Coat. Tech-nol., 192: 213
9. Deckert C A. 1995, Plat. Surf. Finish, 82: 48
10. Oh K W, Kim D G, Kim S H. 2002, J. Appl. Polym. Sci., 84: 1369
11. Jiang S Q, Kan C W, Yuen C W M, et al. 2008, Appl. Polym. Sci., 108: 2630
12. Charbonnier M, Romand M, Harry E, et al. 2001, Appl. Electrochem., 31: 57
13. Simor M, Rahel J, Cernak M, et al. 2003, Surf. Coat. Technol., 172: 1
14. Yarygin V I, Mironov V S, Soloyev N P, et al. 2001, Nuclear Instrum. Methods Phys. Res. B, 185: 228
15. Kord́as K, B́eḱesi J, Vajtai R, et al. 2001, Appl. Surf. Sci., 172: 178
16. Srnivasan R, Mayne-Banton V. 1982, Appl. Phys. Lett., 41: 576
17. Stefěcka M, Kando M, Matsuo H, et al. 2004, J. Mater. Sci., 39: 2215
18. Yuen C W M, Jiang S Q, Kan C W, et al. 2007, Appl. Surf. Sci., 253: 5250
19. Kostíc M, Radíc N, Obradovíc B M, et al. 2009, Plasma Process. Polym., 6: 58
20. Borris J, Dohse A, Hinze A, et al. 2009, Plasma Process. Polym. 6: S258.
21. Esrom H, Seeb̈ock R, Charbonnier M, et al. 2000, Surf. Coat. Technol., 125: 19
22. Han M H, Jegal J P, Park K W, et al. 2007, Surf. Coat. Tech., 201: 4948
23. Kusano Y, Mortensen H, Stenum B, et al. 2007, Plasma Process. Polym., 4: S455
24. Kogelschatz U. 2003, Plasma Chem. Plasma Process., 23: 1
25. Temmerman E, Akishev Y, Trushkin N, et al. 2005, J. Phys. D Appl. Phys., 38: 505
26. Morent R, De Geyter N, Leys C, et al. 2007, Text. Res. J., 77 : 471
27. Wang W C, Kang E T, Neoh K G. 2002, Appl. Surf. Sci., 199: 52
28. Nagasawa C, Kumagai Y, Urabe K, et al. 1999, J. Porou. Mater., 6: 247
29. Yang L Q, Chen J R, Guo Y F, et al. 2009, Appl. Surf. Sci., 255: 4446
30. Choi J H, Lee E S, Baik H K, et al. 2005, Plasma Sources Sci. Technol., 14: 363
31. Massines F, Gouda G, Gherardi N, et al. 2001, Plasmas and Polymers, 6: 35
32. Dorai R, Kushner M J. 2003, J. Phys. D: Appl. Phys., 36: 666
33. Upadhyay D J, Cui N Y, Anderson C A, et al. 2004, Appl. Surf. Sci., 229: 352
34. Shinagawa S, Kumagai Y, Urabe K. 1999, J. Porous Mater., 6: 185