Polymerization and characterization of high conductivity and good adhension polypyrrole films for electromagnetic interference shielding

Chinese Journal of Polymer Science (English Edition)

Volumn 28, Issue 6, 2010, Pages 923-930

  Qiao, Yong Sheng ^a,b   Shenb, La Zhen ^b   Doua, Tao ^a   Huc, Ming ^c  

^a TAIYUAN UNIVERSITY OF TECHNOLOGY   (China)

^b SHANXI DATONG UNIVERSITY   (China)

^c TIANJIN UNIVERSITY   (China)

Author keywords

Adhesion; Conductivity; EMI; Polypyrrole film

Indexed keywords

ADHESION; CHLORINE COMPOUNDS; COUPLING AGENTS; ELECTRIC CONDUCTIVITY; ELECTROMAGNETIC PULSE; ELECTROMAGNETIC SHIELDING; ELECTROMAGNETIC WAVE INTERFERENCE; EPOXY RESINS; IRON COMPOUNDS; MAGNETIC SHIELDING; MORPHOLOGY; PHOTOELECTRON SPECTROSCOPY; POLYMERIZATION; SCANNING ELECTRON MICROSCOPY; SIGNAL INTERFERENCE; SUBSTRATES; SURFACE MORPHOLOGY; X RAY PHOTOELECTRON SPECTROSCOPY;

CHEMICAL POLYMERIZATION; ELECTRICAL CONDUCTIVITY; ELECTROMAGNETIC INTERFERENCE SHIELDING; EMI SHIELDING EFFECTIVENESS; EPOXY RESIN SUBSTRATE; FOUR-POINT PROBE METHOD; POLYPYRROLE FILM; SHIELDING EFFECTIVENESS;

POLYPYRROLES;

EID: 78651322487     PISSN: 02567679     EISSN: 14396203     Source Type: Journal    
DOI: 10.1007/s10118-010-9175-x     Document Type: Article

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