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Volumn 40, Issue 3, 2000, Pages 455-463

Static and dynamic finite element modelling of thermal fatigue effects in insulated gate bipolar transistor modules

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; MATHEMATICAL MODELS; TEMPERATURE DISTRIBUTION; THERMAL STRESS;

EID: 0033875477     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0026-2714(99)00250-4     Document Type: Article
Times cited : (24)

References (15)
  • 1
    • 0342380741 scopus 로고    scopus 로고
    • Advanced IGBT modules for railway traction applications: Reliability testing
    • Berg H, Wolfgang E. Advanced IGBT modules for railway traction applications: reliability testing. Proceedings of IRPS, 1998.
    • (1998) Proceedings of IRPS
    • Berg, H.1    Wolfgang, E.2
  • 2
    • 0004893982 scopus 로고    scopus 로고
    • Reliability of high power IGBT modules: Testing on thermal fatigue effects due to traction cycles
    • Hamidi A, Coquery G, Lallemand R. Reliability of high power IGBT modules: testing on thermal fatigue effects due to traction cycles. EPE Conference'97, vol. 3, 1997. p. 118-23.
    • (1997) EPE Conference'97 , vol.3 , pp. 118-123
    • Hamidi, A.1    Coquery, G.2    Lallemand, R.3
  • 3
    • 0027612158 scopus 로고
    • Failure analysis of power modules: A look at the packaging and reliability of large IGBTs
    • Lambilly H, Kesser HO. Failure analysis of power modules: a look at the packaging and reliability of large IGBTs. IEEE Trans Components, Hybrids and Manufact Tech 1993;16(4):410-7.
    • (1993) IEEE Trans Components, Hybrids and Manufact Tech , vol.16 , Issue.4 , pp. 410-417
    • Lambilly, H.1    Kesser, H.O.2
  • 4
    • 0029234826 scopus 로고
    • Reliability testing and analysis of IGBT power semiconductor modules
    • Jacob P, Held M, Scacco P, Wu W. Reliability testing and analysis of IGBT power semiconductor modules. Proceedings of IEE, 1995.
    • (1995) Proceedings of IEE
    • Jacob, P.1    Held, M.2    Scacco, P.3    Wu, W.4
  • 5
    • 0004835947 scopus 로고    scopus 로고
    • Hybrid power module, a good versatile power management
    • Perruchoiud P, Aloisi P. Hybrid power module, a good versatile power management. EPE Conference'97, vol 3, 1997. p. 124-8.
    • (1997) EPE Conference'97 , vol.3 , pp. 124-128
    • Perruchoiud, P.1    Aloisi, P.2
  • 6
    • 0342380740 scopus 로고    scopus 로고
    • Developments in high power module packaging
    • General review paper October
    • Nigel C. Developments in high power module packaging. General review paper for the European forum on power semiconductors, October 1997.
    • (1997) European Forum on Power Semiconductors
    • Nigel, C.1
  • 7
    • 0041163508 scopus 로고    scopus 로고
    • Thermal simulation of semiconductors IC: General and practical approach
    • Koral VA, Fedasyuk DV. Thermal simulation of semiconductors IC: general and practical approach. Microelectron J 1997;28:221-7.
    • (1997) Microelectron J , vol.28 , pp. 221-227
    • Koral, V.A.1    Fedasyuk, D.V.2
  • 9
    • 0004774598 scopus 로고    scopus 로고
    • A method for tightly couple thermal-electrical simulation
    • Klaassen B. A method for tightly couple thermal-electrical simulation. Microelectron J 1997;28:239-45.
    • (1997) Microelectron J , vol.28 , pp. 239-245
    • Klaassen, B.1
  • 10
    • 0040569340 scopus 로고    scopus 로고
    • Validation of numerical models of ceramic pin grid array packages
    • O'Flaherty M, Cahill C, Rodgers K. Validation of numerical models of ceramic pin grid array packages. Microelectron J 1997;28:229-38.
    • (1997) Microelectron J , vol.28 , pp. 229-238
    • O'Flaherty, M.1    Cahill, C.2    Rodgers, K.3
  • 11
    • 0028739416 scopus 로고
    • Application of finite difference techniques for the thermal modelling of power electronic switching devices. Power electronics and variable speed drives
    • 26-28 October
    • Jamieson DJ, Mansell AD, Stainforth JA, Tebb DW. Application of finite difference techniques for the thermal modelling of power electronic switching devices. Power electronics and variable speed drives. IEE Conference Publication No.339. 26-28 October 1994.
    • (1994) IEE Conference Publication No.339
    • Jamieson, D.J.1    Mansell, A.D.2    Stainforth, J.A.3    Tebb, D.W.4
  • 14
    • 0005220064 scopus 로고    scopus 로고
    • ANSYS is a trademark of ANSYS Inc. Houston, PA
    • ANSYS analysis manual. ANSYS is a trademark of ANSYS Inc. Houston, PA.
    • ANSYS Analysis Manual


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.