A study on the microphysical mechanisms of adsorption in polyimide layers for microelectronic applications

Journal of the Electrochemical Society

Volumn 145, Issue 11, 1998, Pages 4012-4018

  Buchhold, R ^a   Nakladal, A ^a   Gerlach, G ^a   Sahre, K ^b   Muller M ^b   Eichhorn, K J ^b   Herold, M ^c   Gauglitz, G ^c  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b LEIBNIZ INSTITUTE OF POLYMER RESEARCH DRESDEN   (Germany)

^c UNIVERSITY OF TÜBINGEN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRESS; ELECTRIC PROPERTIES; FAILURE ANALYSIS; MECHANICAL PROPERTIES; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; MOISTURE; MOLECULAR STRUCTURE; PLASTIC FILMS; POLYIMIDES; POROUS MATERIALS; SATURATION (MATERIALS COMPOSITION);

VOLUME EXPANSION;

ADSORPTION;

EID: 0032206307     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1838906     Document Type: Article

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