Experimental study on the micromechanical behavior of a PBX simulant using SEM and digital image correlation method

Optics and Lasers in Engineering

Volumn 49, Issue 3, 2011, Pages 366-370

  Zhou, Zhongbin ^a   Chen, Pengwan ^a   Huang, Fenglei ^a   Liu, Siqi ^a  

^a BEIJING INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Digital image correlation; Heterogeneous deformation field; Micromechanical behavior; Polymer bonded explosive simulant

Indexed keywords

AREA OF INTEREST; CONTOUR PLOT; CORRELATION COEFFICIENT; DAMAGE EVOLUTION; DIGITAL IMAGE CORRELATION METHODS; DIGITAL IMAGE CORRELATIONS; EXPERIMENTAL STUDIES; HETEROGENEOUS DEFORMATION FIELDS; HETEROGENEOUS STRAIN FIELD; IN-SITU; MECHANICAL BEHAVIOR; MICRO-SCALES; MICRO-STRUCTURAL; MICROMECHANICAL BEHAVIOR; MICROSCOPIC CRACKS; POLYMER BONDED EXPLOSIVE SIMULANT; POLYMER BONDED EXPLOSIVES; SCANNING ELECTRON MICROSCOPES; SEM; SEM IMAGE; SPECIMEN SURFACES; SPECKLE PATTERNS; STRAIN FIELDS;

CRACKS; DEFORMATION; IMAGE ANALYSIS; POLYMERS; SCANNING ELECTRON MICROSCOPY; STRAIN MEASUREMENT;

CORRELATION METHODS;

EID: 78650851718     PISSN: 01438166     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.optlaseng.2010.11.001     Document Type: Article

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