Fracture behavior of PBX simulation subject to combined thermal and mechanical loads

Polymer Testing

Volumn 28, Issue 6, 2009, Pages 627-635

  Liu, Z W ^a   Xie, H M ^b   Li, K X ^a   Chen, P W ^a   Huang, F L ^a  

^a BEIJING INSTITUTE OF TECHNOLOGY   (China)

^b TSINGHUA UNIVERSITY   (China)

Author keywords

Creep strain; Fracture behavior; Particulate composite; PBXs

Indexed keywords

CLEAVAGE FRACTURE; CREEP PROPERTIES; CREEP STRAIN; DIGITAL IMAGE CORRELATIONS; FILLER PARTICLES; FRACTURE BEHAVIOR; FRACTURE MECHANISMS; FRACTURE MODE; HIGH TEMPERATURE CREEP; INITIAL DAMAGE; INTERCRYSTALLINE; INTERFACIAL DEBONDING; MACROSCOPIC FRACTURES; MECHANICAL LOADS; PARTICULATE COMPOSITE; PBXS; POLYMER BONDED EXPLOSIVES; SHEAR ACTION; SHEAR CRACK;

BRITTLE FRACTURE; CRACKS; MECHANICAL PROPERTIES;

CREEP;

EID: 67650092772     PISSN: 01429418     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymertesting.2009.05.011     Document Type: Article

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