Temperature dependence of thermal conductivity in SiCp based metal-matrix composites

Materials Science and Technology

Volumn 27, Issue 1, 2011, Pages 91-94

  Chu, K ^a   Jia, C C ^a   Liang, X B ^a   Chen, H ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Electron phonon coupling; Interfacial thermal conductance; Metal matrix composites; Thermal conductivity

Indexed keywords

COMPETITIVE INTERACTIONS; CONDUCTION MECHANISM; ELECTRON PHONON; ELECTRON PHONON COUPLINGS; MATRIX INTERFACES; METAL-MATRIX COMPOSITES; TEMPERATURE DEPENDENCE; TEMPERATURE-DEPENDENT THERMAL CONDUCTIVITY; THEORETICAL INVESTIGATIONS; THERMAL CONDUCTANCE;

ELECTRON CORRELATIONS; ELECTRON-PHONON INTERACTIONS; MATERIALS PROPERTIES; METALS; SILICON CARBIDE; THERMAL CONDUCTIVITY;

METALLIC MATRIX COMPOSITES;

EID: 78650844978     PISSN: 02670836     EISSN: 17432847     Source Type: Journal    
DOI: 10.1179/026708309X12547309760768     Document Type: Article

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