Microstructure and thermal properties of diamond/Al composite fabricated by pressureless metal infiltration

Advanced Materials Research

Volumn 150-151, Issue , 2011, Pages 1110-1118

  Cui, Yan ^a   Xu, Songbo ^b   Zhang, Lei ^a   Guo, Shun ^c  

^a BEIJING INSTITUTE OF AERONAUTICAL MATERIALS   (China)

^b NORTH DAKOTA STATE UNIVERSITY   (United States)

^c BEIHANG UNIVERSITY   (China)

Author keywords

Composites; Diamond; Microstructure; Pressureless metal infiltration; Thermal properties

Indexed keywords

ALUMINUM MATRIX; COMPOSITES; DIAMOND PARTICLES; FRACTOGRAPHS; GAAS; HIGH THERMAL CONDUCTIVITY; INTERFACIAL BONDING; INTERFACIAL STRUCTURES; MATRIX; MECHANICAL BEHAVIOR; METAL INFILTRATION; METALLIC MATRICES; POSITIVE EFFECTS; PRESSURELESS; SEM OBSERVATION; THERMAL EXPANSION COEFFICIENTS; THERMAL MANAGEMENT APPLICATIONS; THERMAL MANAGEMENT MATERIAL; THERMAL PROPERTIES; YOUNG'S MODULUS;

BENDING STRENGTH; DIAMONDS; FRACTURE; METALS; MICROSTRUCTURE; SEEPAGE; SEMICONDUCTING SILICON COMPOUNDS; SOIL MECHANICS; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY; THERMAL EXPANSION; THERMAL STRESS;

METALLIC MATRIX COMPOSITES;

EID: 78650640443     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.150-151.1110     Document Type: Conference Paper

References (25)

1. M.J.Ellsworth: Proceedings of the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Vol.2 (2004), p.707-8.
2. P.W.Ruch, O.Beffort, S.Kleiner et al.: Composites Sci. Technol. Vol. 66(2006), p. 2677-2685.
3. M.K.Premkumar, W.H.Hunt jr, R.R.Sawtell: JOM Vol. 9 (1992), p. 24-28.
4. C. Zweben: ASM Handbook Vol. 21 (2001), p. 1078-84.
5. Q.Sun, O.T.Inal: Materials Science & Engineering. A, Structural Materials: Properties, Microstructure and Processing Vol. 41 (1996), p.261.
6. Xuebing LIANG, Ke CHU, Chengchang JIA: ActaMateriae Compositeae Sinica Vol.23(6)(2008), p.192-197.
7. Ke Chu, Zhaofang LIU, Chengchang JIA: Journal of Alloys and Compounds 490(2010), p.453-458.
8. O.Beffort, F.A Khalid, L.Weber et al: Diamond & Related Materials Vol.15(2006), p.1250-1260.
9. L.Weber, C. Von Grünigen: N. Frigeni, 14th Symposium Verbundwerkstoffe undWerkstoffverbunde, 2003, p.801.
10. William B.Johnson, B. Sonuparlak: Journal of Materials Research Vol 8(5)(1993), p.1169-1173.
11. A. Vlasov, V. Ralchenko et al.: Diamond Relat. Mater.Vol. 9 (2000), p.1104.
12. D.J. Twitchen, C.S.J. Pickles, S.E. Coe, R.S. Sussmann, C.E. Hall: Diamond Relat.Mater. Vol.10 (2001), p.731.
13. Cheng HM, Zhou BL, Kitahara A et al.: Mater. Res. Vol. 11(5)(1996), p.1284-92.
14. Coltters RG: Mater. Sci. Eng. Vol. 76(1-2) (1985), p.1-50.
15. Lin RY: Key Eng Mater. Vol.104-107 (1995), p.507-22.
16. Lee JC, Lee J-I, Lee H-I. J : Mater. Sci. Lett. Vol.15(1996), p.1539-42.
17. Cui Yan, Wang Lifeng, Ren Jianyue: Chinese Journal of Aeronautics Vol.21 (2008), p.578-584.
18. D.P.H.Hasselman, L.F.Johnson: J.Compos.Mater: Vol.21(1989), p.508.
19. E.T.Swartz, R.O.Phol: Rev.Mod. Phys:Vol.61(1989), p.605.
20. Gu M. Zhang G, Wu R: Prog Nat Sci: Vol.7 (1997), p.600-7.
21. Ke Chu, ChengChang Jia, Xuebing Liang et al.: Materials and Design: Vol.30 (2009), p.4311-16.
22. R.J Stoner, H.J.Maris, T.R Anthony et al.: Physical Review Letters Vol.68 (1992), p.1563.
23. YANG Bo, YU Jia-kang, CHEN Chuang: Trans. Nonferrous Met. Soc. China Vol.19 (2009), p.1167-1173.
24. A.Miserez, S.stucklin, A.Rossoll et al.: Mater.Sci.Technol. Vol.18(11)(2002), p.1461-1470.
25. K.A.Weidenmann, R.Tavanar, L.Weber: Mater. Sci. Eng. A Vol. 523 (2009), p. 226-234.