Accounting for grain boundary thickness in the sub-micron and nano scales

Reviews on Advanced Materials Science

Volumn 26, Issue 1-2, 2010, Pages 74-90

  Zhang, X ^a,b   Aifantis, K E ^b,c  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b ARISTOTLE UNIVERSITY OF THESSALONIKI   (Greece)

^c MICHIGAN TECHNOLOGICAL UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANALYTICAL GRADIENTS; CONSTANT LOADS; CONSTITUTIVE PROPERTIES; DEFORMATION PROCESS; DISPLACEMENT RATE; FINITE THICKNESS; GRADIENT PLASTICITY; MICRO TENSILE TESTS; NANO SCALE; SENSITIVE DEVICES; STRESS DROP; SUBMICRON;

CRYSTALLINE MATERIALS; DEFORMATION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; NANOINDENTATION; PLASTICITY; STRESS-STRAIN CURVES;

PHASE INTERFACES;

EID: 78650638016     PISSN: 16065131     EISSN: 16058127     Source Type: Journal    
DOI: None     Document Type: Article

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