Development of surface micromachinable capacitive accelerometer using fringe electrical field

TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers

Volumn 2, Issue , 2003, Pages 1383-1386

  Aoyagi, S ^a,b   Tai, Yu Chong ^a  

^a California Institute of Technology   (United States)

^b KANSAI UNIVERSITY   (Japan)

Author keywords

Accelerometers; Capacitance measurement; Capacitors; Dielectric measurements; Dielectric substrates; Electric variables measurement; Electrodes; Polymers; Seismic measurements; Wafer bonding

Indexed keywords

CAPACITANCE; CAPACITANCE MEASUREMENT; SEISMOLOGY; WAFER BONDING;

CAPACITIVE ACCELEROMETERS; DIELECTRIC MEASUREMENTS; DIELECTRIC SUBSTRATES; ELECTRIC VARIABLE MEASUREMENTS; ELECTRICAL FIELD; PARYLENES; PLANAR CAPACITORS; SEISMIC MASS; SEISMIC MEASUREMENTS; SIMPLE STRUCTURES;

ACCELEROMETERS;

EID: 78650598196     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2003.1217032     Document Type: Conference Paper

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