Translation solder self-alignment mechanics modeling for a flip chip in the presence of a viscous fluid

Journal of Electronic Packaging

Volumn 132, Issue 4, 2010, Pages

  Fennell, Brett ^a   Lee, Sangil ^a   Baldwin, Daniel F ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

flip chip; misalignment; no flow; self alignment; solder wetting dynamics; viscous

Indexed keywords

CURING; FLIP CHIP DEVICES; SOLDERING;

FLIP CHIP; MISALIGNMENT; NO FLOWS; SELF-ALIGNMENT; SOLDER REFLOW; SOLDER WETTING; SOLDER WETTING DYNAMIC; UNDERFILLS; VISCOUS; WETTING DYNAMICS;

ALIGNMENT;

EID: 78650483463     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.4002825     Document Type: Article

References (13)

1. Pascarella, N. W., and Baldwin, D. F., 1998, "Compression Flow Modeling of Underfill Encapsulants for Low Cost Flip Chip Assembly," IEEE Trans. Compon., Packag., Manuf. Technol., Part C, 21(4), pp. 325-335.
2. Baldwin, D. F., and Pascarella, N. W., 1998, "Manufacturing Analysis of Underfill Processing for Low Cost Flip Chip," J. Electron. Manuf., 8(1), pp. 39-50.
3. Thorpe, R., McGovern, L. P., and Baldwin, D. F., 1998, "Analysis of Process Yield in Low Cost Flip Chip on Board Assembly Processes," Thermo- Mechanical Characterization of Evolving Packaging Materials and Structures, ASME, New York, EEP-Vol. 24, pp. 27-33.
4. Thorpe, R., Baldwin, D. F., and McGovern, L. P., 1999, "High Throughput Flip Chip Processing and Reliability Analysis Using No-Flow Underfills," Proceedings of the Electronic Components and Technology Conference, San Diego, CA, p. 419.
5. Goldmann, L. S., 1969, "Geometric Optimization of Controlled Collapse Interconnections," IBM J. Res. Dev., 13, pp. 251-265.
6. Goldmann, L. S., 1972, "Self Alignment Capability of Controlled-Collapse Chip Joining," 22nd Electronic Components Conference, Orlando, FL, pp. 332-339.
7. Patra, S. K., and Lee, Y. C., 1991, "Quasi-Static Modeling of the Self- Alignment Mechanism in Flip Chip Soldering-Part I: Single Solder Joint," ASME J. Electron. Packag., 113(4), pp. 337-342.
8. Patra, S. K., and Lee, Y. C., 1991, "Modeling of Self-Alignment Mechanism in Flip Chip Soldering-Part II: Multichip Solder Joints," Proceedings of the 41st Electronic Components and Technology Conference, Atlanta, GA, May 11-16, pp. 783-788.
9. Brakke, K., 1994, SURFACE EVOLVER Manual, Version 1.94, Geometry Center, University of Minnesota, Minneapolis, MN.
10. Wei, L., Patra, S. K., and Lee, Y. C., 1995, "Design of Solder Joints for Self-Aligned Optoelectronic Assemblies," IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 18(3), pp. 543-551.
11. Munson, B., Young, D., and Okiishi, T., 1994, Fundamentals of Fluid Mechanics, 2nd ed., Wiley, New York.
12. Harkness, H. W., 1964, Elementary Plane Rigid Dynamics, Academic, New York.
13. Hibbeler, R. C., 1992, Engineering Mechanics, 6th ed., Macmillian, New York.