Efficiency enhancement of a dielectric barrier plasma discharge by dielectric barrier optimization

Review of Scientific Instruments

Volumn 81, Issue 11, 2010, Pages

  Meiners, Annette ^a   Leck, Michael ^a   Abel, Bernd ^b  

^a UNIVERSITY OF APPLIED SCIENCES AND ARTS   (Germany)

^b UNIVERSITY OF LEIPZIG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC BARRIER; DIELECTRIC BARRIER DISCHARGES; EFFICIENCY ENHANCEMENT; ELECTRICAL MEASUREMENT; PLASMA DISCHARGE; RELATIVE PERMITTIVITY; SECONDARY EMISSION COEFFICIENTS; SPECTROSCOPIC CHARACTERIZATION;

DIELECTRIC MATERIALS; ELECTRIC DISCHARGES; OPTIMIZATION;

DIELECTRIC DEVICES;

EID: 78650260110     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3501963     Document Type: Article

References (32)

1. R. Hippler, S. Pfau, M. Schmidt, and K. H. Schoenbach, Low Temperature Plasma Physics (Wiley-VCH, Berlin, 2001).
2. G. Borcia, C. A. Anderson, and N. M. D. Brown, Plasma Sources Sci. Technol. PSTEEU 0963-0252 14, 259 (2005). 10.1088/0963-0252/14/2/006 (Pubitemid 40665912)
3. J. M. Grace, D. R. Freeman, R. Corts, and W. Kosel, J. Vac. Sci. Technol. A JVTAD6 0734-2101 14, 727 (1996). 10.1116/1.580379 (Pubitemid 126082153)
4. S. F. Mirala, E. Monette, R. Bartnikas, G. Czeremuszkin, M. Latr̀che, and M. R. Wertheimer, Plasmas Polym. PLPOFQ 1084-0184 5, 63 (2000). 10.1023/A:1009531831404 (Pubitemid 32317928)
5. A. Wolkenhauer, A. Meiners, P. Rehn, G. Avramidis, M. Leck, and W. Viöl, Holztechnologie HLZTAW 0018-3881 46, 40 (2005).
6. K. H. Becker, U. Kogelschatz, K. H. Schoenbach, and R. J. Barker, Non-Equilibrium Air Plasmas at Atmospheric Pressure, Series in Plasma Physics, (IOP, Bristol, Philadelphia, 2005).
7. U. Kogelschatz, B. Eliasson, and W. Egli, Pure Appl. Chem. PACHAS 0033-4545 71, 1819 (1999). 10.1351/pac199971101819
8. U. Kogelschatz, Plasma Chem. Plasma Process. PCPPDW 0272-4324 23, 1 (2003). 10.1023/A:1022470901385 (Pubitemid 36257393)
9. V. I. Gibalov, J. Dímal, M. Wronsky, and V. G. Samoilovich, Contrib. Plasma Phys. CPPHEP 0863-1042 31, 89 (1991). 10.1002/ctpp.2150310110
10. R. Li, Q. Tang, S. Yin, Y. Yamaguchi, and T. Sato, Phys. Plasmas PHPAEN 1070-664X 11, 715 (2004).
11. G. Auday, P. Guillot, and J. Galy, J. Appl. Phys. JAPIAU 0021-8979 88, 4871 (2000). 10.1063/1.1290461
12. T. J. Vink, A. R. Balkenende, R. G. F. A. Verbeek, H. A. M. van Hal, and S. T. de Zwart, Appl. Phys. Lett. APPLAB 0003-6951 80, 2216 (2002). 10.1063/1.1464229 (Pubitemid 34635974)
13. Y. Ohtsu, T. Shimazoe, T. Misawa, and H. Fujita, Thin Solid Films THSFAP 0040-6090 506-507, 545 (2006). 10.1016/j.tsf.2005.08.071
14. C. Heuser, " Zur Ozonerzeugung in elektrischen Gasentladungen., " Ph.D. thesis, RWTH Aachen, 1985.
15. G. Dilecce, P. F. Ambrico, and S. De Benedicts, Pure Appl. Chem. PACHAS 0033-4545 82, 1201 (2010). 10.1351/PAC-CON-09-08-19
16. M. Šimek, V. Babick, M. Člupek, and P. Šunka, J. Phys. D JPAPBE 0022-3727 34, 3185 (2001). 10.1088/0022-3727/34/21/311 (Pubitemid 33120736)
17. H. S. Park, S. J. Kim, H. M. Joh, T. H. Chung, S. H. Bae, and S. H. Leem, Phys. Plasmas PHPAEN 1070-664X 17, 033502 (2010). 10.1063/1.3330507
18. N. K. Bibinov, A. A. Fateev, and K. Wiesemann, J. Phys. D JPAPBE 0022-3727 34, 1819 (2001). 10.1088/0022-3727/34/12/309 (Pubitemid 32637004)
19. F. Massines, A. Rabehi, P. Decomps, R. B. Gadri, P. Śgur, and C. Mayoux, J. Appl. Phys. JAPIAU 0021-8979 83, 2950 (1998). 10.1063/1.367051
20. See www.crystal-gmbh.com/seiten-deu/daten/subst-waf.html.
21. P. Y. Raizer, Gas Discharge Physics (Springer, Berlin, 1997).
22. E. K. Beauchamp, J. Am. Ceram. Soc. JACTAW 0002-7820 54, 484 (1971). 10.1111/j.1151-2916.1971.tb12184.x
23. See www.keramverband.de/keramik/deutsch/fachinfo/eigenschaften/ eigenschaften-elektrisch.htm.
24. K. D. Schomann, Electr. Eng. EENGFQ 0948-7921 56, 223 (1974).
25. R. Hayakawa, T. Yoshimura, A. Ashida, N. Fujimura, H. Kitahata, and M. Yuasa, J. Appl. Phys. JAPIAU 0021-8979 96, 6094 (2004). 10.1063/1.1810202 (Pubitemid 40715247)
26. A. Qayyum, S. Zeb, S. Ali, A. Waheed, and M. Zakullah, Plasma Chem. Plasma Process. PCPPDW 0272-4324 25, 551 (2005). 10.1007/s11090-005-4999-9 (Pubitemid 41343908)
27. N. Masoud, K. Martus, M. Figus, and K. Becker, Contrib. Plasma Phys. CPPHEP 0863-1042 45, 32 (2005). 10.1002/ctpp.200510004
28. A. Meiners, M. Leck, and B. Abel, Plasma Sources Sci. Technol. PSTEEU 0963-0252 18, 045015 (2009). 10.1088/0963-0252/18/4/045015
29. E. Stoffels, A. J. Flickweert, W. W. Stoffels, and G. M. W. Kroesen, Plasma Sources Sci. Technol. PSTEEU 0963-0252 11, 383 (2002). 10.1088/0963-0252/11/4/304 (Pubitemid 35433980)
30. R. Valdivia-Barrientos, J. Pacheco-Sotelo, M. Pacheco-Pacheco, J. S. Benítez-Read, and R. López-Callejas, Plasma Sources Sci. Technol. PSTEEU 0963-0252 15, 237 (2006). 10.1088/0963-0252/15/2/008 (Pubitemid 43672632)
31. J. H. Kim, Y. H. Choi, and Y. S. Hwang, Phys. Plasmas PHPAEN 1070-664X 13, 093501 (2006). 10.1063/1.2338282 (Pubitemid 44491656)
32. The Siglo Data base, CPAT and KINEMA Software, http://www.siglo-kinema. com.