Electrochemical behaviors of the magnesium alloy substrates in various pretreatment solutions

Applied Surface Science

Volumn 256, Issue 9, 2010, Pages 2988-2994

  Zhu, Yanping ^a   Yu, Gang ^a   Hu, Bonian ^b   Lei, Xiping ^a   Yi, Haibo ^a   Zhang, Jun ^a  

^a HUNAN UNIVERSITY   (China)

^b HUNAN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Activation; Interlayer; Magnesium alloy; Pickling; Zinc immersion

Indexed keywords

CHEMICAL ACTIVATION; CHROMIUM COMPOUNDS; COATINGS; ELECTROPLATING; HYDROFLUORIC ACID; INTERFACES (MATERIALS); MAGNESIUM ALLOYS; MANGANESE COMPOUNDS; METALLIC FILMS; NICKEL COMPOUNDS; NITRIC ACID; PICKLING; POTASH; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; THIN FILMS; ZINC;

AZ91D MAGNESIUM ALLOYS; DIRECT ELECTROLESS NI-P PLATING; ELECTROCHEMICAL BEHAVIORS; INTERFACE REACTIONS; INTERLAYER; OPEN CIRCUIT POTENTIAL; PRE-TREATMENT SOLUTIONS; ZINC IMMERSION;

MAGNESIUM COMPOUNDS;

EID: 75449116903     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2009.11.062     Document Type: Article

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