Fabrication and evaluation of microscale thermoelectric modules of Bi 2Te3-based alloys

Journal of Micromechanics and Microengineering

Volumn 20, Issue 12, 2010, Pages

  Liu, Da Wei ^a   Li, Jing Feng ^a   Chen, Chen ^a,b   Zhang, Bo Ping ^b   Li, Liangliang ^a  

^a TSINGHUA UNIVERSITY   (China)

^b UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CU ELECTRODE; FINE-GRAINED MATERIAL; INPUT CURRENT; MAXIMUM OUTPUT POWER; MECHANICAL CUTTING; MECHANICAL STRENGTH; MICRO-SCALES; NANO-SIC; OUTPUT VOLTAGES; P-TYPE; PELTIER; PHOTOLITHOGRAPHIC PATTERNING; PHOTOLITHOGRAPHY PROCESS; SEEBECK; TEMPERATURE DIFFERENCES; THERMOELECTRIC MODULES; WORKING MODE;

FABRICATION; PHOTOLITHOGRAPHY; SILICON CARBIDE; SPARK PLASMA SINTERING; TELLURIUM COMPOUNDS; THERMOELECTRICITY;

CERIUM ALLOYS;

EID: 78649756972     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/20/12/125031     Document Type: Article

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