A comparison between the corrosion behavior of nanostructured copper thin films deposited on oxidized silicon and copper sheet in alkaline media

Surface and Coatings Technology

Volumn 205, Issue 7, 2010, Pages 2218-2224

  Yeganeh, M ^a   Saremi, M ^a  

^a UNIVERSITY OF TEHRAN   (Iran)

Author keywords

Copper; Corrosion; Nanostructured

Indexed keywords

ALKALINE MEDIA; BREAKDOWN POTENTIAL; CHEMICAL COMPOSITIONS; COPPER PROTECTION; COPPER SHEETS; COPPER THIN FILM; CORROSION BEHAVIOR; CORROSION CURRENT DENSITIES; CRYSTALLINE STRUCTURE; DEPOSITED FILMS; HYDROXYL ION; IMMERSION TESTS; NANO-STRUCTURED; NANOSTRUCTURED COPPER; OXIDIZED SILICON; PASSIVE LAYER; POLARIZATION TESTS; SEM; SUBSTRATE TEMPERATURE; XRD; XRD PATTERNS;

COPPER; CORROSION RESISTANCE; CORROSIVE EFFECTS; CRYSTAL ORIENTATION; DEPOSITS; ELECTROCHEMICAL CORROSION; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY; MORPHOLOGY; POLARIZATION; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING SILICON COMPOUNDS; SILICON OXIDES; THIN FILMS; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

COPPER DEPOSITS;

EID: 78649741351     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2010.08.145     Document Type: Article

References (25)

1. Yu B., Woo P., Erb U. Scr. Mater. 2007, 56:353.
2. Vinogradov A., Mimaki T., Hashimoto S., Valiev R. Scr. Mater. 1999, 41:319.
3. Rofagha R., Langer R., El-Sherik A.M., Erb U., Palumbo G., Aust K.T. Scr. Metall. Mater. 1999, 25:2867.
4. Miyamoto H., Harada K., Mimaki T., Vinogradov A., Hashimoto S. Corros. Sci. 2008, 50:1215.
5. Tao S., Li D.Y. Wear 2007, 263:363.
6. Lu H.B., Li Y., Wang F.H. Thin Solid Films 2006, 510:197.
7. Hashimoto K. Mater. Sci. Eng. A 1995, 198:1.
8. Saremi M., Yeganeh M. Micro Nano Lett 2010, 5:70.
9. Saremi M., Yeganeh M. Mater. Chem. Phys. 2010, 123:456.
10. Rofagha R., Splinter S.J., Erb U., McIntyre N.S. Nanostruct. Mater. 1994, 4:69.
11. Singh J., Wolfe D.E. J. Mater. Sci. 2005, 40:1.
12. Kunze J., Maurice V., Klein L.H., Strehblow H.H., Marcus Corros. Sci. 2004, 46:245.
13. Strehblow H.H., Titze B. Electrochim. Acta 1980, 25:839.
14. Pourbaix M. Atlas of Electrochemical Equilibria in Aqueous Solutions 1974, NACE, USA.
15. Millet B., Fiaud C., Hinnen C., Sutter E.M.M. Corros. Sci. 1995, 37:1903.
16. Feng Y., Siow K.S., Teo W.K., Tan K.L., Hsieh A.K. Corrosion 1997, 53:389.
17. Sander U., Strehblow H.H., Dohrmann J.K. J. Phys. Chem. 1981, 85:447.
18. Chan H.Y.H., Takoudis C.G., Weaver M.J. J. Phys. Chem. B 1999, 103:357.
19. Strehblow H.H., Speckmann H.D. Werkst. Korros. 1984, 35:512.
20. Porter D.A., Easterling K.E. Phase Transformation in Metals and Alloys 1992, Chapman & Hall, UK.
21. Ingelgem Y.V., Tourwé E., Vereecken J., Hubin A. Electrochim. Acta 2008, 53:7523.
22. Mackdonald J.R. Impedance Spectroscopy. Emphasizing Solid Materials and System 1987, John Wiley & Sons, USA.
23. Lee S.Y., Choi S.H., Park C.O. Thin Solid Films 2000, 359:261.
24. He J.B., Lu D.Y., Jin G.P. Appl. Surf. Sci. 2006, 253:689.
25. Shams El Din A.M., Abd El Wahab F.M. Electrochim. Acta 1964, 9:113.