A study of an LED backlight thermal module

Heat Transfer - Asian Research

Volumn 39, Issue 8, 2010, Pages 619-627

  Su, Ay ^a   Chen, S Y ^a   Lin, Y C ^a  

^a YUAN ZE UNIVERSITY   (Taiwan)

Author keywords

Heat conduction; LED; Natural convection; Thermal resistance

Indexed keywords

BACKLIGHT MODULE; ELECTRIC POWER; HEAT SINK DESIGN; HEAT TRANSFER DEVICE; HIGH CONDUCTIVITY; LED; LED BACKLIGHT; LED SUBSTRATES; PLATE TEMPERATURE; POWER EMISSION; PROTECTIVE DESIGNS; QUANTITY CONTROL; RATE OF INCREASE; RISING RATE; TEMPERATURE CHANGES; TEMPERATURE DIFFERENCES; THERMAL MECHANISMS; THERMAL MODULES; THERMAL RESISTANCE; TOTAL POWER;

FINS (HEAT EXCHANGE); HEAT CONDUCTION; NATURAL CONVECTION; PLATES (STRUCTURAL COMPONENTS);

HEAT RESISTANCE;

EID: 78649717246     PISSN: 10992871     EISSN: 15231496     Source Type: Journal    
DOI: 10.1002/htj.20321     Document Type: Article

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