Study on the sintering characteristics and application in cu bulk bonding of Ag-nanoparticle paste

Cailiao Gongcheng/Journal of Materials Engineering

Volumn , Issue 10, 2010, Pages 5-8

  Yan, Jian Feng ^a   Zou, Gui Sheng ^a   Li, Jian ^a   Wu, Ai Ping ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Ag nanoparticle paste; Bonding; Electronic package; Sintering characteristic

Indexed keywords

BONDING; CHEMICAL BONDS; FRACTURE; METAL NANOPARTICLES; SCANNING ELECTRON MICROSCOPY; SILVER METALLOGRAPHY; SINTERING;

AG NANOPARTICLE; ELECTRONIC PACKAGE; FRACTURE APPEARANCE; HIGH MAGNIFICATIONS; MICROSCOPIC ANALYSIS; PLASTIC DISTORTIONS; SINTERING CHARACTERISTICS; SINTERING TEMPERATURES;

SILVER NANOPARTICLES;

EID: 78649639520     PISSN: 10014381     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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