Investigation of coefficient of thermal expansion of SIO2 particulate-reinforced epoxy composites

International SAMPE Symposium and Exhibition (Proceedings)

Volumn , Issue , 2010, Pages

  Jang, Jae Soon ^a   Gibson, Ronald F ^a   Suhr, Jonghwan ^a  

^a Reno   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COEFFICIENT OF THERMAL EXPANSION; COMPOSITE SPECIMENS; DIRECT SHEAR; FINITE ELEMENT ANALYSIS; MATERIAL PROPERTY; MATRIX MATERIALS; MICRO MECHANICS MODEL; REINFORCED EPOXY; SILICON DIOXIDE; THERMAL STABILITY; THERMAL STRAIN; YOUNG'S MODULUS;

ELASTIC MODULI; ELASTICITY; EPOXY RESINS; FILLERS; FINITE ELEMENT METHOD; PARTICLE REINFORCED COMPOSITES; SILICA; SILICON OXIDES; SYNTHETIC RESINS; TENSILE TESTING; THERMAL STRESS; THERMODYNAMIC STABILITY; TITRATION;

THERMAL EXPANSION;

EID: 78649478260     PISSN: 08910138     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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