Thermal properties of new copper matrix composite reinforced by β-eucryptite particulates

Materials Science and Technology

Volumn 26, Issue 12, 2010, Pages 1521-1524

  Xue, Z W ^a   Liu, Z ^a   Wang, L D ^a   Fei, W D ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Eucryptite; Composite Materials; Powder Metallurgy; Thermal Conductivity; Thermal Expansion

Indexed keywords

COEFFICIENT OF THERMAL EXPANSION; COPPER MATRIX COMPOSITE; CU MATRIX COMPOSITES; HIGH THERMAL CONDUCTIVITY; INTERFACIAL REACTION PRODUCT; LOW THERMAL EXPANSION; NEGATIVE COEFFICIENTS; SCANNING ELECTRON MICROSCOPE; THERMAL EXPANSION COEFFICIENTS; THERMAL PROPERTIES; THERMO-PHYSICAL PROPERTY; TRANSMISSION ELECTRON MICROSCOPE;

ALUMINUM POWDER METALLURGY; ELECTRON MICROSCOPES; METALLIC MATRIX COMPOSITES; METALLURGY; PARTICLE REINFORCED COMPOSITES; SCANNING ELECTRON MICROSCOPY; THERMAL CONDUCTIVITY; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL STRESS; THERMOANALYSIS; TITRATION; TRANSMISSION ELECTRON MICROSCOPY;

THERMAL EXPANSION;

EID: 78649353053     PISSN: 02670836     EISSN: 17432847     Source Type: Journal    
DOI: 10.1179/174328409X428927     Document Type: Article

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