Hot-pressed AlN-Cu metal matrix composites and their thermal properties

Journal of Materials Science

Volumn 39, Issue 4, 2004, Pages 1309-1313

  Tian, J ^a   Shobu, K ^a  

^a Kyushu Center   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM NITRIDE; COPPER; DENSIFICATION; HOT PRESSING; SINTERING; THERMAL CONDUCTIVITY; THERMAL EXPANSION; VOLUME FRACTION; YTTRIUM COMPOUNDS;

COEFFICIENT OF THERMAL EXPANSION; LIQUID PHASE SINTERING; POWDER MIXTURE;

METALLIC MATRIX COMPOSITES;

EID: 1442336061     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/B:JMSC.0000013890.01343.0c     Document Type: Article

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