Microstructure evolution of monolithic nanoporous copper from dual-phase Al 35 atom % Cu alloy

Journal of the Electrochemical Society

Volumn 157, Issue 12, 2010, Pages

  Liu, Wenbo ^a,b   Zhang, Shichao ^b   Li, Ning ^a   Zheng, Jiwei ^b   Xing, Yalan ^b  

^a SICHUAN UNIVERSITY   (China)

^b BEIHANG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

AL-CU ALLOYS; ALKALINE SOLUTIONS; AQUEOUS SOLUTIONS; CORROSIVE ENVIRONMENT; CU ALLOY; CU ATOMS; DEALLOYING; ELECTROCHEMICAL ACTIVITIES; FORMATION MECHANISM; HCL SOLUTION; MICROSTRUCTURE EVOLUTIONS; NANO-POROUS; NANOPOROUS STRUCTURES; NAOH SOLUTIONS; SODIUM HYDROXIDES; SURFACE DIFFUSIVITY;

ALLOYS; ALUMINUM; ATOMS; BIOLOGY; CERIUM ALLOYS; CORROSION; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; HYDROCHLORIC ACID; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SODIUM; SOLUTIONS; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

COPPER ALLOYS;

EID: 78449296040     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3497308     Document Type: Article

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