MDS study on the adhesive heat transfer in micro-channel cooler

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Volumn , Issue , 2010, Pages 630-633

  Wang, Shun ^a   Zhang, Yan ^a   Hu, Zhili ^a,b   Liu, Johan ^a,b  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE INTERFACES; CURING AGENTS; CURING PROCESS; EPOXY MATRICES; GROWTH PROCESS; HEAT GENERATORS; HIGH TEMPERATURE; MICROCHANNEL COOLERS; MOLECULAR DYNAMICS SIMULATIONS; NONEQUILIBRIUM MOLECULAR DYNAMICS METHODS; PERIODIC BOUNDARY CONDITIONS; THERMAL CONDUCTION; THERMAL PERFORMANCE; TRANSFER PROCESS; TRANSFER TECHNIQUE;

CARBON NANOTUBES; COMPUTER SIMULATION; COOLING SYSTEMS; CURING; HEAT TRANSFER; MOLECULAR DYNAMICS; PACKAGING; THERMAL CONDUCTIVITY; THERMOANALYSIS;

CHIP SCALE PACKAGES;

ADHESIVES; CARBON; COOLING SYSTEMS; CURING; EPOXIDES; HEAT TRANSFER; PACKAGING; SIMULATION; THERMAL ANALYSIS; THERMAL CONDUCTIVITY;

EID: 78449292182     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2010.5583859     Document Type: Conference Paper

References (9)

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