Integration of phosphor printing and encapsulant dispensing processes for wafer level LED array packaging

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Volumn , Issue , 2010, Pages 1386-1392

  Chen, Kewei ^a   Zhang, Rong ^a   Lee, S W Ricky ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE STRENGTH; BLUE LEDS; ENCAPSULANTS; LED ARRAYS; LED PACKAGING; NOVEL PROCESS; OPTICAL PERFORMANCE; PACKING DENSITY; PHOSPHOR LAYERS; PHOSPHOR SCREENS; PROCESSING PROCEDURES; SOLID STATE LIGHTING; WAFER LEVEL; WHITE LIGHT; WHITE-LIGHT ILLUMINATION; YELLOW PHOSPHORS;

LIGHT EMISSION; LIGHT EMITTING DIODES; LIGHTING; PACKAGING; PHOSPHORS; PRINTING PRESSES; SCREEN PRINTING;

ELECTRONICS PACKAGING;

EID: 78449270914     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2010.5582822     Document Type: Conference Paper

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