Modification of bacterial structures by a low-temperature gas plasma and influence on packaging material

Journal of Applied Microbiology

Volumn 109, Issue 6, 2010, Pages 1875-1885

  Muranyi, P ^a   Wunderlich, J ^a   Langowski, H C ^a  

^a FRAUNHOFER INSTITUTE FOR PROCESS ENGINEERING AND PACKAGING IVV   (Germany)

Author keywords

Biomolecules; Cascaded dielectric barrier discharge; Decomposition; DNA; Plasma mechanisms; Plastic material modification; Sterilization

Indexed keywords

BACTERIOLOGY; BIOMOLECULES; CELLS; CYTOLOGY; DIELECTRIC DEVICES; DIELECTRIC MATERIALS; DNA; FLOW CONTROL; PACKAGING MATERIALS; PLASMA APPLICATIONS; POLYMER FILMS; TEMPERATURE;

CASCADED DIELECTRIC BARRIER DISCHARGE; DIELECTRIC BARRIER DISCHARGE TREATMENTS; DIELECTRIC BARRIER DISCHARGES; LOWS-TEMPERATURES; MATERIALS MODIFICATION; PLASMA MECHANISM; PLASMA TREATMENT; PLASTIC MATERIAL MODIFICATION; PLASTIC MATERIALS; PROPERTY;

DIELECTRIC BARRIER DISCHARGE;

POLYMER;

BACTERIUM; DECOMPOSITION; LOW TEMPERATURE; MITOCHONDRIAL DNA; PACKAGING WASTE; PLASTIC; POLYMER;

ARTICLE; BACILLUS; BACILLUS ATROPHAEUS; BACTERIAL CELL; BACTERIAL ENDOSPORE; CHEMICAL MODIFICATION; DIELECTRIC CONSTANT; DNA DAMAGE; LOW TEMPERATURE; NONHUMAN; NUCLEOTIDE SEQUENCE; PACKAGING MATERIAL;

BACILLUS ATROPHAEUS; BACTERIA (MICROORGANISMS);

EID: 78449249919     PISSN: 13645072     EISSN: 13652672     Source Type: Journal    
DOI: 10.1111/j.1365-2672.2010.04815.x     Document Type: Article

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