Analysis of series resistance of crystalline silicon solar cell with two-layer front metallization based on light-induced plating

Solar Energy Materials and Solar Cells

Volumn 95, Issue 1, 2011, Pages 22-25

  Hyung Lee, Jin ^a   Hyun Lee, Young ^a   Yong Ahn, Jun ^a   Jeong, Ji Weon ^a  

^a LG Electronics Inc   (South Korea)

Author keywords

Light induced plating; Metallization; Solar cells

Indexed keywords

BEFORE AND AFTER; CELL PERFORMANCE; CONTACT RESISTIVITIES; CROSS-SECTION AREA; CRYSTALLINE SILICON SOLAR CELLS; EFFICIENCY GAIN; INDIVIDUAL COMPONENTS; METAL GRID; METALLIZATIONS; RESISTANCE REDUCTION; SEED LAYER; SERIES RESISTANCES; TWO LAYERS;

CONTACT RESISTANCE; ELECTRODES; IMPACT RESISTANCE; METALLIZING; METALS; PLATING; SILICON SOLAR CELLS; SOLAR CELLS;

CYTOLOGY;

EID: 78149359224     PISSN: 09270248     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.solmat.2010.04.065     Document Type: Conference Paper

References (5)

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2. L.A. Grenon, Electroplating method in US Patent no. 4 251 327, Motorola Inc., Schaumburg L., USA, 1981
3. D.L. Meier, and D.K. Schroder Contact resistance: its measurement and relative importance to power loss in a solar cell IEEE Trans.Electron Device DC-31 1984 647 653
4. D.L. Meier, E.A. Good, R.A. Garcia, B.L. Bingham, S. Yamanaka, V. Chandrasekaran, and C. Bucher, Determining components of series resistance from measurements on a finished cell, in: Proceedings of the IEEE 4th World Conference on Photovoltaic Energy Conversion, Hawaii, USA, (2006) 13151318
5. A. Mette, New concepts for front side metallization of industrial silicon solar cells, Dissertation, Fraunhofer Institute for Solar Energy Systems, Alnert-Ludwigs-Universitt, Freiburg im Breisgau, 2007