Phenylethynylnaphthalic endcapped imide oligomers with reduced cure temperatures

European Polymer Journal

Volumn 46, Issue 11, 2010, Pages 2145-2155

  Yang, Yang ^a   Fan, Lin ^a   Ji, Mian ^a   Yang, Shiyong ^a  

^a INSTITUTE OF CHEMISTRY   (China)

Author keywords

Imide oligomers; Low cure temperature; Phenylethynylnaphthalic anhydride; Thermally cured polyimides

Indexed keywords

4-PHENYLETHYNYLPHTHALIC ANHYDRIDE; ACTIVITY ENERGY; CURE TEMPERATURE; CURING BEHAVIOR; EFFECT OF CHEMICALS; FLEXURAL STRENGTH; IMIDE OLIGOMERS; LOW CURE TEMPERATURE; MELT PROCESSING; MELT VISCOSITIES; MODEL COMPOUND; NUMBER AVERAGE MOLECULAR WEIGHT; PHENYLETHYNYL; PHENYLETHYNYLNAPHTHALIC ANHYDRIDE; POLYMERIZATION DEGREE; THERMAL AND MECHANICAL PROPERTIES; THERMAL CURING; THERMALLY CURED POLYIMIDES;

CHEMICAL COMPOUNDS; MECHANICAL PROPERTIES; MOLECULAR WEIGHT; OLIGOMERS; POLYIMIDES; POLYMERIZATION; TENSILE STRENGTH;

CURING;

EID: 78149285138     PISSN: 00143057     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.eurpolymj.2010.09.005     Document Type: Article

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